CWEA E/I 2 Study Guide Quest || Exam Questions and Answers
( 2026 ) CWEA E_I Grade 2 Study Guide – Electrical and
Instrumentation Exam || Most Recent Exam 2026 Actual
Complete Real Exam Questions And Correct Answers
(Verified Answers) Already Graded A+ | Guaranteed
Success!! | Newest Exam | Just Released!!
1. In a simple ratio system, the independent variable is:
a. both measured and controlled.
b. controlled but not measured.
c. measured but not controlled.
d. neither measured nor controlled. - ANSWER-c. measured but
not controlled
2. The root-mean-square method is used to
calculate:
a. integral and derivative
action.
b. proportional band
or gain.
c. system
accuracy.
d. transducer bias - ANSWER-c. system
accuracy.
,3. To simulate an RTD input, you
use a:
a. digital
VOM.
b.
potentiometer.
c. resistance decade
box.
d. wally box - ANSWER-c. resistance
decade box.
4. SCADA systems typically span:
a. an entire plant.
b. many miles.
c. part of the plant.
d. up to 5,000 feet - ANSWER-b. many miles.
5. In the ISA tag PIC-21, the P stands for:
a. Positive.
b. Pressure.
c. Process.
d. Proportional - ANSWER-b. Pressure.
The outputs of a digital transducer are in
the form of: a. 1 to 5 mv.
b. 4 to 20 ma.
c. digital computer words.
d. on or off signals - ANSWER-c. digital computer words
,A shield around the signal lead is the most effective
protection against:
a.
impedance.
b. unwanted
conductance.
c. noise.
d. inverted sources. - ANSWER-c.
noise.
8. The most important consideration in
loop control is:
a.
accessibility.
b.
accuracy.
c. cost.
d. response. - ANSWER-d.
response
9. Which element makes a
programmable logic
controller system
flexible?
a.
Memory.
, b.
I/O.
c.
Program.
d. Power supply - ANSWER-c.
Program
10. Local I/O expansion involves the
addition of:
a. a second
processor.
b. a shift
register.
c. data-handling
capabilities.
d. I/O points within the rack. - ANSWER-d. I/O points
within the rack.
11. A major cause of problems in multi-layer printed
circuit boards is:
a. age.
b.
corrosion.
c. interlayer
separation.
d. overheating. - ANSWER-c. interlayer
separation
( 2026 ) CWEA E_I Grade 2 Study Guide – Electrical and
Instrumentation Exam || Most Recent Exam 2026 Actual
Complete Real Exam Questions And Correct Answers
(Verified Answers) Already Graded A+ | Guaranteed
Success!! | Newest Exam | Just Released!!
1. In a simple ratio system, the independent variable is:
a. both measured and controlled.
b. controlled but not measured.
c. measured but not controlled.
d. neither measured nor controlled. - ANSWER-c. measured but
not controlled
2. The root-mean-square method is used to
calculate:
a. integral and derivative
action.
b. proportional band
or gain.
c. system
accuracy.
d. transducer bias - ANSWER-c. system
accuracy.
,3. To simulate an RTD input, you
use a:
a. digital
VOM.
b.
potentiometer.
c. resistance decade
box.
d. wally box - ANSWER-c. resistance
decade box.
4. SCADA systems typically span:
a. an entire plant.
b. many miles.
c. part of the plant.
d. up to 5,000 feet - ANSWER-b. many miles.
5. In the ISA tag PIC-21, the P stands for:
a. Positive.
b. Pressure.
c. Process.
d. Proportional - ANSWER-b. Pressure.
The outputs of a digital transducer are in
the form of: a. 1 to 5 mv.
b. 4 to 20 ma.
c. digital computer words.
d. on or off signals - ANSWER-c. digital computer words
,A shield around the signal lead is the most effective
protection against:
a.
impedance.
b. unwanted
conductance.
c. noise.
d. inverted sources. - ANSWER-c.
noise.
8. The most important consideration in
loop control is:
a.
accessibility.
b.
accuracy.
c. cost.
d. response. - ANSWER-d.
response
9. Which element makes a
programmable logic
controller system
flexible?
a.
Memory.
, b.
I/O.
c.
Program.
d. Power supply - ANSWER-c.
Program
10. Local I/O expansion involves the
addition of:
a. a second
processor.
b. a shift
register.
c. data-handling
capabilities.
d. I/O points within the rack. - ANSWER-d. I/O points
within the rack.
11. A major cause of problems in multi-layer printed
circuit boards is:
a. age.
b.
corrosion.
c. interlayer
separation.
d. overheating. - ANSWER-c. interlayer
separation
