J-STD Exam| Actual Questions and
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(Graded A+)
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J-STD Exam
, Charred or have damage in excess of that to be determined to be a minor surface
flaw that degrades the component below the Spec Requirements or affects Form,
Fit, Function.
-Not expose ceramic on the terminal end face.
- Be no greater than 25% of width or thickness of any termination side
-Be no more than 50% on top of a 5 or 3 sided termination component
compatible both from cleaning process standpoint and chemical standpoint.
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2 of 42
Term
IPC stands for...
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The Institute for Interconnecting
The International Panel for Packaging
and Packaging Electronic
Electronic Circuits
Circuits
The Institution for Interfacing and The Institute for Integrating and
Protecting Electronic Circuits Processing Electronic Components
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, 3 of 42
Term
4.5.1 - Gold embrittlement can occur regardless ofgold thickness
when...
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the requirements shall be imposed on compatible both from cleaning
subassembly drawings, PO's, and process standpoint and chemical
subcontracts. standpoint.
95% of all the surface mounted
Solder volume is low or dwell
components regardless off gold
time is not sufficient.
thickness
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4 of 42
Term
3.2.2 - If contamination exceeds the limits ...
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intervals between analysis, compatible both from cleaning
replacement or replenishment process standpoint and chemical
shall be shortened. standpoint.
Answers Latest Updated
(Graded A+)
Correct
Incorrect
J-STD Exam
, Charred or have damage in excess of that to be determined to be a minor surface
flaw that degrades the component below the Spec Requirements or affects Form,
Fit, Function.
-Not expose ceramic on the terminal end face.
- Be no greater than 25% of width or thickness of any termination side
-Be no more than 50% on top of a 5 or 3 sided termination component
compatible both from cleaning process standpoint and chemical standpoint.
Don't know?
2 of 42
Term
IPC stands for...
Give this one a try later!
The Institute for Interconnecting
The International Panel for Packaging
and Packaging Electronic
Electronic Circuits
Circuits
The Institution for Interfacing and The Institute for Integrating and
Protecting Electronic Circuits Processing Electronic Components
Don't know?
, 3 of 42
Term
4.5.1 - Gold embrittlement can occur regardless ofgold thickness
when...
Give this one a try later!
the requirements shall be imposed on compatible both from cleaning
subassembly drawings, PO's, and process standpoint and chemical
subcontracts. standpoint.
95% of all the surface mounted
Solder volume is low or dwell
components regardless off gold
time is not sufficient.
thickness
Don't know?
4 of 42
Term
3.2.2 - If contamination exceeds the limits ...
Give this one a try later!
intervals between analysis, compatible both from cleaning
replacement or replenishment process standpoint and chemical
shall be shortened. standpoint.
