COR 2 TEST PREP COMPREHENSIVE REVIEW
2026 QUESTIONS AND DETAILED SOLUTIONS
◉ Network Tap. Answer: Device for monitoring network traffic.
◉ Wi-Fi Analyzers. Answer: Tools for analyzing wireless network
performance.
◉ RAM. Answer: Volatile memory for temporary data storage.
◉ DDR3. Answer: Third generation of Double Data Rate
Synchronous RAM.
◉ DDR4. Answer: Fourth generation of Double Data Rate
Synchronous RAM.
◉ DDR5. Answer: Fifth generation of Double Data Rate Synchronous
RAM.
◉ Installing RAM. Answer: Process of adding RAM to a computer.
,◉ Single-Channel Architecture. Answer: Memory configuration
using one channel.
◉ Multichannel Architecture. Answer: Memory configuration using
multiple channels.
◉ ECC. Answer: Error-Correcting Code memory for data integrity.
◉ Non-ECC. Answer: Standard memory without error correction.
◉ SATA. Answer: Serial Advanced Technology Attachment for
storage devices.
◉ Magnetic Hard Drives. Answer: Traditional storage using magnetic
disks.
◉ Solid-State Drives. Answer: Storage using flash memory, faster
than HDDs.
◉ RAID. Answer: Redundant Array of Independent Disks for data
redundancy.
◉ USB Flash Drives. Answer: Portable storage using flash memory.
,◉ Secure Digital Cards. Answer: Memory cards for portable devices.
◉ Optical Drives. Answer: Drives that read/write data on optical
discs.
◉ Motherboard. Answer: Main circuit board connecting all
components.
◉ ATX. Answer: Advanced Technology eXtended motherboard form
factor.
◉ microATX. Answer: Smaller motherboard form factor than ATX.
◉ ITX. Answer: Mini-ITX, compact motherboard form factor.
◉ Expansion Cards. Answer: Cards added to motherboard for
additional functionality.
◉ BIOS. Answer: Basic Input/Output System for hardware
initialization.
, ◉ CPU. Answer: Central Processing Unit, the computer's main
processor.
◉ Clock Rate. Answer: Speed at which a CPU executes instructions.
◉ Overclocking. Answer: Running a CPU at higher than rated speed.
◉ Cache Memory. Answer: High-speed memory for frequently
accessed data.
◉ Intel and AMD. Answer: Two major CPU manufacturers.
◉ Heat Sinks. Answer: Devices that dissipate heat from components.
◉ Thermal Paste. Answer: Substance applied to improve heat
transfer.
◉ Fans. Answer: Mechanical devices for airflow and cooling.
◉ Liquid Cooling Systems. Answer: Use liquid to transfer heat away
from components.
◉ Power Supply. Answer: Converts AC to DC power for components.
2026 QUESTIONS AND DETAILED SOLUTIONS
◉ Network Tap. Answer: Device for monitoring network traffic.
◉ Wi-Fi Analyzers. Answer: Tools for analyzing wireless network
performance.
◉ RAM. Answer: Volatile memory for temporary data storage.
◉ DDR3. Answer: Third generation of Double Data Rate
Synchronous RAM.
◉ DDR4. Answer: Fourth generation of Double Data Rate
Synchronous RAM.
◉ DDR5. Answer: Fifth generation of Double Data Rate Synchronous
RAM.
◉ Installing RAM. Answer: Process of adding RAM to a computer.
,◉ Single-Channel Architecture. Answer: Memory configuration
using one channel.
◉ Multichannel Architecture. Answer: Memory configuration using
multiple channels.
◉ ECC. Answer: Error-Correcting Code memory for data integrity.
◉ Non-ECC. Answer: Standard memory without error correction.
◉ SATA. Answer: Serial Advanced Technology Attachment for
storage devices.
◉ Magnetic Hard Drives. Answer: Traditional storage using magnetic
disks.
◉ Solid-State Drives. Answer: Storage using flash memory, faster
than HDDs.
◉ RAID. Answer: Redundant Array of Independent Disks for data
redundancy.
◉ USB Flash Drives. Answer: Portable storage using flash memory.
,◉ Secure Digital Cards. Answer: Memory cards for portable devices.
◉ Optical Drives. Answer: Drives that read/write data on optical
discs.
◉ Motherboard. Answer: Main circuit board connecting all
components.
◉ ATX. Answer: Advanced Technology eXtended motherboard form
factor.
◉ microATX. Answer: Smaller motherboard form factor than ATX.
◉ ITX. Answer: Mini-ITX, compact motherboard form factor.
◉ Expansion Cards. Answer: Cards added to motherboard for
additional functionality.
◉ BIOS. Answer: Basic Input/Output System for hardware
initialization.
, ◉ CPU. Answer: Central Processing Unit, the computer's main
processor.
◉ Clock Rate. Answer: Speed at which a CPU executes instructions.
◉ Overclocking. Answer: Running a CPU at higher than rated speed.
◉ Cache Memory. Answer: High-speed memory for frequently
accessed data.
◉ Intel and AMD. Answer: Two major CPU manufacturers.
◉ Heat Sinks. Answer: Devices that dissipate heat from components.
◉ Thermal Paste. Answer: Substance applied to improve heat
transfer.
◉ Fans. Answer: Mechanical devices for airflow and cooling.
◉ Liquid Cooling Systems. Answer: Use liquid to transfer heat away
from components.
◉ Power Supply. Answer: Converts AC to DC power for components.
