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MECH&AE 183A Manufacturing Processes
University of California, Los Angeles (UCLA)
Spring 2020 Instructor: Gregg Lewis
Examination III
June 3, 2020: 10am – 12pm (2hrs)
Name: _______________, __________________
Last First
TOTAL SCORE: 80 POINTS
* Submit completed test to CCLE course webpage either as a MS Word document or Adobe .pdf file
Multiple Choice (20 pts): Circle, highlight or enter the answer below.
1. After exposure to light, a positive resist becomes (a) less soluble or (b) more soluble to the
chemical developing fluid?
Answer: (b)
2. Which etching process produces the more anisotropic etch in IC fabrication? (a) plasma etching,
or (b) wet chemical etching.
Answer: (a)
3. The aspect ratio in microsystem technology is best defined by which one of the following? (a)
degree of anisotropy in etched features, (b) height-to-width ratio of the fabricated features, (c)
height-to-width ratio of the MST device, (d) length-to-width ratio of the fabricated features, (e)
thickness-to-length ratio of the MST device.
Answer: (b)
4. A self-assembled monolayer has a thickness that is which one of the following: (a) one
micrometer, (b) one millimeter, (c) one molecule, or (d) one nanometer?
Answer: (c)
5. Rapid prototyping technologies are never used to make production parts: (a) true or (b) false.
Answer: (b)
6. The most common work material used in microsystem technology is which one of the following?
(a) boron, (b) gold, (c) nickel, (d) potassium hydroxide, or (e) silicon.
Answer: (e)
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, 7. In abrasive water jet cutting, the abrasive particles are added to the water stream: (a) before it
enters the pumping unit, (b) just before it enters the nozzle, (c) while it is in the nozzle, or (d) right
after it exits the nozzle?
Answer: (d)
8. The liquid used to create the discharge path between the tool and the work in electric discharge
machining is called which one of the following: (a) dielectric fluid, (b) electrolyte, (c) organic
solvent, or (d) mineral oil?
Answer: (a)
9. Which one of the following rapid prototyping processes uses a photosensitive liquid polymer as
the starting material: (a) droplet deposition manufacturing, (b) fused-deposition modeling, (c)
laminated-object manufacturing, (d) selective laser sintering, or (e) stereolithography?
Answer: (e)
10. Which one of the following is the source of silicon for semiconductor processing: (a) pure Si
found in nature, (b) SiC, (c) Si3N4, or (d) SiO 2?
Answer: (d)
11. (2 points) Which of the following are doping processes in IC fabrication (two best answers): (a)
chemical vapor deposition, (b) diffusion, (c) ion implantation, (d) physical vapor deposition, (e)
plasma etching, (f) thermal oxidation, and (g) wet etching?
Answer: (b) and (d)
12. Which one of the following processes would be appropriate to drill a hole with a square cross
section, 6 mm (0.25 in) on a side and 25 mm (1 in) deep in a steel workpiece: (a) abrasive jet
machining, (b) chemical milling, (c) EDM, (d) laser beam machining, (e) oxyfuel cutting, (f) water
jet cutting, or (g) wire EDM?
Answer: (c)
13. Which one of the following wire bonding techniques primary attachment method is using high
heat (welding): (a) thermosonic bonding, (b) thermocompression bonding, or (c) ultrasonic
bonding.
Answer: (b)
14. Electroplating is used to plate a thin metal layer on non-metal surfaces: (a) true or (b) false.
Answer: (b)
15. Which one technique turns silicon into silicon oxide: (a) chemical vapor deposition, (b) dielectric
sputtering, (c) ion implantation, (d) evaporation, or (e) thermal oxidation.
Answer: (a)
16. Which one of the following chip technologies has contact pins on the socket, not on the chip: a)
BGA, b) LIGA, c) FOWLP, d) LGA, or e) PGA.
Answer: (d)
Page 2
This study source was downloaded by 100000899606070 from CourseHero.com on 02-21-2026 06:35:54 GMT -06:00
https://www.coursehero.com/file/88172467/Exam-3-Sp201777pdf/
MECH&AE 183A Manufacturing Processes
University of California, Los Angeles (UCLA)
Spring 2020 Instructor: Gregg Lewis
Examination III
June 3, 2020: 10am – 12pm (2hrs)
Name: _______________, __________________
Last First
TOTAL SCORE: 80 POINTS
* Submit completed test to CCLE course webpage either as a MS Word document or Adobe .pdf file
Multiple Choice (20 pts): Circle, highlight or enter the answer below.
1. After exposure to light, a positive resist becomes (a) less soluble or (b) more soluble to the
chemical developing fluid?
Answer: (b)
2. Which etching process produces the more anisotropic etch in IC fabrication? (a) plasma etching,
or (b) wet chemical etching.
Answer: (a)
3. The aspect ratio in microsystem technology is best defined by which one of the following? (a)
degree of anisotropy in etched features, (b) height-to-width ratio of the fabricated features, (c)
height-to-width ratio of the MST device, (d) length-to-width ratio of the fabricated features, (e)
thickness-to-length ratio of the MST device.
Answer: (b)
4. A self-assembled monolayer has a thickness that is which one of the following: (a) one
micrometer, (b) one millimeter, (c) one molecule, or (d) one nanometer?
Answer: (c)
5. Rapid prototyping technologies are never used to make production parts: (a) true or (b) false.
Answer: (b)
6. The most common work material used in microsystem technology is which one of the following?
(a) boron, (b) gold, (c) nickel, (d) potassium hydroxide, or (e) silicon.
Answer: (e)
Page 1
This study source was downloaded by 100000899606070 from CourseHero.com on 02-21-2026 06:35:54 GMT -06:00
https://www.coursehero.com/file/88172467/Exam-3-Sp201777pdf/
, 7. In abrasive water jet cutting, the abrasive particles are added to the water stream: (a) before it
enters the pumping unit, (b) just before it enters the nozzle, (c) while it is in the nozzle, or (d) right
after it exits the nozzle?
Answer: (d)
8. The liquid used to create the discharge path between the tool and the work in electric discharge
machining is called which one of the following: (a) dielectric fluid, (b) electrolyte, (c) organic
solvent, or (d) mineral oil?
Answer: (a)
9. Which one of the following rapid prototyping processes uses a photosensitive liquid polymer as
the starting material: (a) droplet deposition manufacturing, (b) fused-deposition modeling, (c)
laminated-object manufacturing, (d) selective laser sintering, or (e) stereolithography?
Answer: (e)
10. Which one of the following is the source of silicon for semiconductor processing: (a) pure Si
found in nature, (b) SiC, (c) Si3N4, or (d) SiO 2?
Answer: (d)
11. (2 points) Which of the following are doping processes in IC fabrication (two best answers): (a)
chemical vapor deposition, (b) diffusion, (c) ion implantation, (d) physical vapor deposition, (e)
plasma etching, (f) thermal oxidation, and (g) wet etching?
Answer: (b) and (d)
12. Which one of the following processes would be appropriate to drill a hole with a square cross
section, 6 mm (0.25 in) on a side and 25 mm (1 in) deep in a steel workpiece: (a) abrasive jet
machining, (b) chemical milling, (c) EDM, (d) laser beam machining, (e) oxyfuel cutting, (f) water
jet cutting, or (g) wire EDM?
Answer: (c)
13. Which one of the following wire bonding techniques primary attachment method is using high
heat (welding): (a) thermosonic bonding, (b) thermocompression bonding, or (c) ultrasonic
bonding.
Answer: (b)
14. Electroplating is used to plate a thin metal layer on non-metal surfaces: (a) true or (b) false.
Answer: (b)
15. Which one technique turns silicon into silicon oxide: (a) chemical vapor deposition, (b) dielectric
sputtering, (c) ion implantation, (d) evaporation, or (e) thermal oxidation.
Answer: (a)
16. Which one of the following chip technologies has contact pins on the socket, not on the chip: a)
BGA, b) LIGA, c) FOWLP, d) LGA, or e) PGA.
Answer: (d)
Page 2
This study source was downloaded by 100000899606070 from CourseHero.com on 02-21-2026 06:35:54 GMT -06:00
https://www.coursehero.com/file/88172467/Exam-3-Sp201777pdf/
