IPC A 610 FINAL TEST 2026 QUESTIONS WITH CORRECT ANSWERS GRADED A+

IPC CID FINAL TEST 2026 QUESTIONS
WITH CORRECT ANSWERS GRADED A+

>> Surface mount technology (SMT)
Answer: Components soldered directly to PCB surface — no through-hole


>> Through-hole technology (THT)
Answer: Components with leads inserted through holes and soldered


>> Mixed technology
Answer: Board using both SMT and through-hole components


>> Component package
Answer: Physical form of an electronic component


>> QFP
Answer: Quad Flat Package — surface mount IC with leads on all four sides


>> BGA
Answer: Ball Grid Array — surface mount IC with solder balls on bottom


>> LGA
Answer: Land Grid Array — no balls — pads on package mate with board
pads


>> QFN
Answer: Quad Flat No-lead — compact SMT package with pads on bottom
edges

, >> SOIC
Answer: Small Outline Integrated Circuit — SMT IC with gull-wing leads


>> SOT
Answer: Small Outline Transistor — SMT transistor package


>> 0402
Answer: Imperial component size code — 0.04" × 0.02" — standard small
passive


>> 0201
Answer: Smaller SMT passive — 0.02" × 0.01" — requires precise
placement


>> 01005
Answer: Ultra-small SMT component — challenging for manufacturing


>> Chip resistor
Answer: SMT resistor in standard package — 0402, 0603, 0805 common
sizes


>> MLCC
Answer: Multi-layer ceramic capacitor — most common SMT capacitor


>> Electrolytic capacitor
Answer: Polarized capacitor — larger values — radial or SMT


>> Crystal oscillator
Answer: Frequency reference component — timing sensitive placement