IPC-A-610 - Chapter 7 || Error-free Answers 100%.
Through-Hole Technology correct answers - The placement of any component on the electronic
assembly does not prevent the insertion or removal of any hardware (tool clearance included)
used to mount the assembly
- Bonding material is sufficient to hold the part but does not encapsulate and cover component
identification
Connection Mounting - Orientation correct answers Inspection usually starts with a general
overall view of the electronic assembly, then follows each component/wire to its connection,
concentrating on the lead into the connection, the connection and the tail end of the lead/wire
leaving the connection. The wire/lead protrusion step for all lands should be saved for last so that
the board can be flipped over and all connections checked together.
*Component Mounting - Orientation - Horizontal
Target - Class 1,2,3 correct answers Nonpolarized components are oriented so that markings are
read the same way (left-to-right or top-to-bottom)
Component Mounting - Orientation - Vertical
Acceptable - Class 1,2,3 correct answers - Polarized part is mounted with a long ground lead
- Nonpolarized component markings read from bottom to top
Component Mounting - Lead Forming
Defect - Class 1,2,3 correct answers Lead is kinked
Component Mounting - Lead Forming - Space between Seal/Weld and Bend
Acceptable - Class 1,2,3 correct answers Leads of through-hole mounted component extend at
least one diameter or thickness but not less than 0.8 mm [0.03 in] from the body, solder bead, or
lead weld
Component Mounting - Lead Forming - Space between Seal/Weld and Bend
, Defect - Class 1,2,3 correct answers Fractured lead weld, solder bead, or component body lead
seal
Component Mounting - Lead Forming - Stress Relief correct answers - With camel hump bends.
Configuration incorporating a single camel hump may have the body positioned off-center.
- Loop bends may be used if the location of the mounting holes prevents the use of a standard
bend if there is no possibility of shortening the lead to any adjacent component lead or
conductor. Use of loop bends may impact circuit impedance, etc., and shall be approved by
design engineering
Component Mounting - Lead Forming - Stress Relief
Acceptable - Class 1,2,3 correct answers - Component lead exiting component body is
approximately parallel to major body axis
- Component centering may be offset as a result of the type of stress relief bond
Component Mounting - Lead Forming - Stress Relief
Acceptable - Class 1
Process Indicator - Class 2
Defect - Class 3 correct answers Lead bends less than one diameter or thickness but less than
0.8mm [0.03 in] away from body seal
Component Mounting - Lead Forming - Damage
Acceptable - Class 1,2,3 correct answers No nicks or deformation exceeding 10% of the
diameter, width or thickness of the lead
Component Mounting - Lead Forming - Damage
Defect - Class 1,2,3 correct answers Heavy indentations such as serrated pliers mark
Component Mounting - Leads Crossing Conductors
Through-Hole Technology correct answers - The placement of any component on the electronic
assembly does not prevent the insertion or removal of any hardware (tool clearance included)
used to mount the assembly
- Bonding material is sufficient to hold the part but does not encapsulate and cover component
identification
Connection Mounting - Orientation correct answers Inspection usually starts with a general
overall view of the electronic assembly, then follows each component/wire to its connection,
concentrating on the lead into the connection, the connection and the tail end of the lead/wire
leaving the connection. The wire/lead protrusion step for all lands should be saved for last so that
the board can be flipped over and all connections checked together.
*Component Mounting - Orientation - Horizontal
Target - Class 1,2,3 correct answers Nonpolarized components are oriented so that markings are
read the same way (left-to-right or top-to-bottom)
Component Mounting - Orientation - Vertical
Acceptable - Class 1,2,3 correct answers - Polarized part is mounted with a long ground lead
- Nonpolarized component markings read from bottom to top
Component Mounting - Lead Forming
Defect - Class 1,2,3 correct answers Lead is kinked
Component Mounting - Lead Forming - Space between Seal/Weld and Bend
Acceptable - Class 1,2,3 correct answers Leads of through-hole mounted component extend at
least one diameter or thickness but not less than 0.8 mm [0.03 in] from the body, solder bead, or
lead weld
Component Mounting - Lead Forming - Space between Seal/Weld and Bend
, Defect - Class 1,2,3 correct answers Fractured lead weld, solder bead, or component body lead
seal
Component Mounting - Lead Forming - Stress Relief correct answers - With camel hump bends.
Configuration incorporating a single camel hump may have the body positioned off-center.
- Loop bends may be used if the location of the mounting holes prevents the use of a standard
bend if there is no possibility of shortening the lead to any adjacent component lead or
conductor. Use of loop bends may impact circuit impedance, etc., and shall be approved by
design engineering
Component Mounting - Lead Forming - Stress Relief
Acceptable - Class 1,2,3 correct answers - Component lead exiting component body is
approximately parallel to major body axis
- Component centering may be offset as a result of the type of stress relief bond
Component Mounting - Lead Forming - Stress Relief
Acceptable - Class 1
Process Indicator - Class 2
Defect - Class 3 correct answers Lead bends less than one diameter or thickness but less than
0.8mm [0.03 in] away from body seal
Component Mounting - Lead Forming - Damage
Acceptable - Class 1,2,3 correct answers No nicks or deformation exceeding 10% of the
diameter, width or thickness of the lead
Component Mounting - Lead Forming - Damage
Defect - Class 1,2,3 correct answers Heavy indentations such as serrated pliers mark
Component Mounting - Leads Crossing Conductors
