IPC-A-610 - Chapter 7 UPDATED ACTUAL Questions And Correct Answers
C
Terms in this set (86)
Through-Hole Technology - The placement of any component on the electronic assembly does not prevent
the insertion or removal of any hardware (tool clearance included) used to mount
the assembly
- Bonding material is sufficient to hold the part but does not encapsulate and
cover component identification
Connection Mounting - Orientation Inspection usually starts with a general overall view of the electronic assembly,
then follows each component/wire to its connection, concentrating on the lead
into the connection, the connection and the tail end of the lead/wire leaving the
connection. The wire/lead protrusion step for all lands should be saved for last so
that the board can be flipped over and all connections checked together.
*Component Mounting - Orientation - Horizontal Nonpolarized components are oriented so that markings are read the same way
Target - Class 1,2,3 (left-to-right or top-to-bottom)
Component Mounting - Orientation - Vertical - Polarized part is mounted with a long ground lead
Acceptable - Class 1,2,3 - Nonpolarized component markings read from bottom to top
Component Mounting - Lead Forming Lead is kinked
Defect - Class 1,2,3
Component Mounting - Lead Forming - Space between Leads of through-hole mounted component extend at least one diameter or
Seal/Weld and Bend thickness but not less than 0.8 mm [0.03 in] from the body, solder bead, or lead
Acceptable - Class 1,2,3 weld
Component Mounting - Lead Forming - Space between Fractured lead weld, solder bead, or component body lead seal
Seal/Weld and Bend
Defect - Class 1,2,3
, Component Mounting - Lead Forming - Stress Relief - With camel hump bends. Configuration incorporating a single camel hump may
have the body positioned off-center.
- Loop bends may be used if the location of the mounting holes prevents the use
of a standard bend if there is no possibility of shortening the lead to any adjacent
component lead or conductor. Use of loop bends may impact circuit impedance,
etc., and shall be approved by design engineering
Component Mounting - Lead Forming - Stress Relief - Component lead exiting component body is approximately parallel to major
Acceptable - Class 1,2,3 body axis
- Component centering may be offset as a result of the type of stress relief bond
Component Mounting - Lead Forming - Stress Relief Lead bends less than one diameter or thickness but less than 0.8mm [0.03 in] away
Acceptable - Class 1 from body seal
Process Indicator - Class 2
Defect - Class 3
Component Mounting - Lead Forming - Damage No nicks or deformation exceeding 10% of the diameter, width or thickness of the
Acceptable - Class 1,2,3 lead
Component Mounting - Lead Forming - Damage Heavy indentations such as serrated pliers mark
Defect - Class 1,2,3
Component Mounting - Leads Crossing Conductors - Sleeve does not interfere with formation of the required solder connection
Acceptable - Class 1,2,3 - Sleeve covers area of protection designated
Component Mounting - Leads Crossing Conductors Splitting and/or unraveling of sleeving
Not Established - Class 1
Defect - Class 2,3
Component Mounting - Leads Crossing Conductors A component lead crossing an electrically noncommon conductor violates
Defect - Class 2,3 minimum electrical clearance
Component Mounting - Hole Obstruction Parts and components obstruct solder flow onto the primary side (solder
Process Indicator - Class 2 destination side) lands of plated through-holes required to be soldered
Defect - Class 3
Component Mounting - DIP/SIP Devices and Sockets Amount of tilt is limited by minimum lead protrusion and height requirements
Acceptable - Class 1,2,3
Component Mounting - DIP/SIP Devices and Sockets - Tilt of the component exceeds maximum component height limits
Defect - Class 1,2,3 - Lead protrusion does not meet acceptance requirements due to tilt of
component
Component Mounting - Radial Leads - Vertical Component tilt does not violate minimum electrical clearance
Acceptable - Class 1,2,3
Component Mounting - Radial Leads - Vertical - Spacers Spacer is not in full contact with component and board
Acceptable (Supported Holes) - Class 1,2
Process Indicator (Supported Holes) - Class 3
Defect (Unsupported Holes) - Class 1,2,3
C
Terms in this set (86)
Through-Hole Technology - The placement of any component on the electronic assembly does not prevent
the insertion or removal of any hardware (tool clearance included) used to mount
the assembly
- Bonding material is sufficient to hold the part but does not encapsulate and
cover component identification
Connection Mounting - Orientation Inspection usually starts with a general overall view of the electronic assembly,
then follows each component/wire to its connection, concentrating on the lead
into the connection, the connection and the tail end of the lead/wire leaving the
connection. The wire/lead protrusion step for all lands should be saved for last so
that the board can be flipped over and all connections checked together.
*Component Mounting - Orientation - Horizontal Nonpolarized components are oriented so that markings are read the same way
Target - Class 1,2,3 (left-to-right or top-to-bottom)
Component Mounting - Orientation - Vertical - Polarized part is mounted with a long ground lead
Acceptable - Class 1,2,3 - Nonpolarized component markings read from bottom to top
Component Mounting - Lead Forming Lead is kinked
Defect - Class 1,2,3
Component Mounting - Lead Forming - Space between Leads of through-hole mounted component extend at least one diameter or
Seal/Weld and Bend thickness but not less than 0.8 mm [0.03 in] from the body, solder bead, or lead
Acceptable - Class 1,2,3 weld
Component Mounting - Lead Forming - Space between Fractured lead weld, solder bead, or component body lead seal
Seal/Weld and Bend
Defect - Class 1,2,3
, Component Mounting - Lead Forming - Stress Relief - With camel hump bends. Configuration incorporating a single camel hump may
have the body positioned off-center.
- Loop bends may be used if the location of the mounting holes prevents the use
of a standard bend if there is no possibility of shortening the lead to any adjacent
component lead or conductor. Use of loop bends may impact circuit impedance,
etc., and shall be approved by design engineering
Component Mounting - Lead Forming - Stress Relief - Component lead exiting component body is approximately parallel to major
Acceptable - Class 1,2,3 body axis
- Component centering may be offset as a result of the type of stress relief bond
Component Mounting - Lead Forming - Stress Relief Lead bends less than one diameter or thickness but less than 0.8mm [0.03 in] away
Acceptable - Class 1 from body seal
Process Indicator - Class 2
Defect - Class 3
Component Mounting - Lead Forming - Damage No nicks or deformation exceeding 10% of the diameter, width or thickness of the
Acceptable - Class 1,2,3 lead
Component Mounting - Lead Forming - Damage Heavy indentations such as serrated pliers mark
Defect - Class 1,2,3
Component Mounting - Leads Crossing Conductors - Sleeve does not interfere with formation of the required solder connection
Acceptable - Class 1,2,3 - Sleeve covers area of protection designated
Component Mounting - Leads Crossing Conductors Splitting and/or unraveling of sleeving
Not Established - Class 1
Defect - Class 2,3
Component Mounting - Leads Crossing Conductors A component lead crossing an electrically noncommon conductor violates
Defect - Class 2,3 minimum electrical clearance
Component Mounting - Hole Obstruction Parts and components obstruct solder flow onto the primary side (solder
Process Indicator - Class 2 destination side) lands of plated through-holes required to be soldered
Defect - Class 3
Component Mounting - DIP/SIP Devices and Sockets Amount of tilt is limited by minimum lead protrusion and height requirements
Acceptable - Class 1,2,3
Component Mounting - DIP/SIP Devices and Sockets - Tilt of the component exceeds maximum component height limits
Defect - Class 1,2,3 - Lead protrusion does not meet acceptance requirements due to tilt of
component
Component Mounting - Radial Leads - Vertical Component tilt does not violate minimum electrical clearance
Acceptable - Class 1,2,3
Component Mounting - Radial Leads - Vertical - Spacers Spacer is not in full contact with component and board
Acceptable (Supported Holes) - Class 1,2
Process Indicator (Supported Holes) - Class 3
Defect (Unsupported Holes) - Class 1,2,3
