IPC 610 General Terms UPDATED ACTUAL Questions And Correct Answers
Terms in this set (30)
Class 1 — General Electronic Products Includes products suitable for applications where the major requirement is
function of the completed assembly.
Class 2 — Dedicated Service Electronic Products Includes products where continued performance and extended life is required,
and for which uninterrupted service is desired but not critical. Typically the end-
use environment would not cause failures.
Class 3 — High Performance Electronic Products Includes products where continued high performance or performance-on-
demand is critical, equipment downtime cannot be tolerated, end-use
environment may be uncommonly harsh, and the equipment must function when
required, such as life support or other critical systems.
Target Condition A condition that is close to perfect/preferred, however, it is a desirable condition
and not always achievable and may not be necessary to ensure reliability of the
assembly in its service environment.
Acceptable Condition This characteristic indicates a condition that, while not necessarily perfect, will
maintain the integrity and reliability of the assembly in its service environment.
Defect Condition A defect is a condition that may be insufficient to ensure the form, fit or function
of the assembly in its end use environment.
Process Indicator Condition A process indicator is a condition (not a defect) which identifies a characteristic
that does not affect the form, fit or function of a product.
Conditions Not Specified Conditions that are not specified as defective or as a process indicator maybe
considered acceptable unless it can be established that the condition affects user
defined form, fit, function.
Primary Side That side of a packaging and interconnecting structure (PCB) that is so defined on
the master drawing.
Secondary Side That side of a packaging and interconnecting structure (PCB) that is opposite the
primary side.
Solder Source Side The solder source side is that side of the PCB to which solder is applied.
Solder Destination Side The solder destination side is that side of the PCB that the
solder flows toward in a through-hole application.
Cold Solder Connection A solder connection that exhibits poor wetting and that is
characterized by a grayish porous appearance.
Electrical Clearance the minimum spacing between noncommon uninsulated conductors.
Terms in this set (30)
Class 1 — General Electronic Products Includes products suitable for applications where the major requirement is
function of the completed assembly.
Class 2 — Dedicated Service Electronic Products Includes products where continued performance and extended life is required,
and for which uninterrupted service is desired but not critical. Typically the end-
use environment would not cause failures.
Class 3 — High Performance Electronic Products Includes products where continued high performance or performance-on-
demand is critical, equipment downtime cannot be tolerated, end-use
environment may be uncommonly harsh, and the equipment must function when
required, such as life support or other critical systems.
Target Condition A condition that is close to perfect/preferred, however, it is a desirable condition
and not always achievable and may not be necessary to ensure reliability of the
assembly in its service environment.
Acceptable Condition This characteristic indicates a condition that, while not necessarily perfect, will
maintain the integrity and reliability of the assembly in its service environment.
Defect Condition A defect is a condition that may be insufficient to ensure the form, fit or function
of the assembly in its end use environment.
Process Indicator Condition A process indicator is a condition (not a defect) which identifies a characteristic
that does not affect the form, fit or function of a product.
Conditions Not Specified Conditions that are not specified as defective or as a process indicator maybe
considered acceptable unless it can be established that the condition affects user
defined form, fit, function.
Primary Side That side of a packaging and interconnecting structure (PCB) that is so defined on
the master drawing.
Secondary Side That side of a packaging and interconnecting structure (PCB) that is opposite the
primary side.
Solder Source Side The solder source side is that side of the PCB to which solder is applied.
Solder Destination Side The solder destination side is that side of the PCB that the
solder flows toward in a through-hole application.
Cold Solder Connection A solder connection that exhibits poor wetting and that is
characterized by a grayish porous appearance.
Electrical Clearance the minimum spacing between noncommon uninsulated conductors.
