ECEN 350 Exam 1 Lu Questions With Correct
Answers
What |transforms |high-level |language |code |to |Assembly |language? |- |CORRECT |ANSWER✔✔-
Compiler
What |changes |Assembly |language |code |to |Machine |code? |- |CORRECT |ANSWER✔✔-Assembler
Memory |- |CORRECT |ANSWER✔✔-Where |the |programs |and |data |kept
Processor |- |CORRECT |ANSWER✔✔-Active |part |of |the |computer. |It |adds |numbers, |test |
numbers, |signals |I/O |etc
CPU |- |CORRECT |ANSWER✔✔-Central |Processor |Unit
Dram |- |CORRECT |ANSWER✔✔-Dynamic |Random |Access |Memory. |Dynamic |RAM. |takes |the |
same |amount |of |time |to |access |the |memory |no |matter |what |portion |of |the |memory |is |read.
Datapath |- |CORRECT |ANSWER✔✔-Performs |arithmetic |operations
Control |- |CORRECT |ANSWER✔✔-Tells |the |datapath, |memory, |and |I/O |devices |what |to |do |
according |to |the |wishes |of |the |instructions |of |the |program
cache |- |CORRECT |ANSWER✔✔-a |safe |place |for |hiding |things, |consists |of |a |small, |fast |memory |
that |acts |as |a |buffer |for |the |DRAM |memory
, Implementation |- |CORRECT |ANSWER✔✔-hardware |that |obeys |the |architecture |design |of |
principal |technique
Instruction |Set |Architecture |- |CORRECT |ANSWER✔✔-Includes |anything |programmers |need |to |
know |to |make |a |binary |machine |language |program |work |correctly, |including |instructions, |I/O |
devices |and |etc.
VLSI |- |CORRECT |ANSWER✔✔-very |large-scale |integrated |circuit |integrated |circuit |integrates |
hundreds |to |millions |of |transistors |into |a |single |chip
defect |- |CORRECT |ANSWER✔✔-microscopic |flaw |in |a |wafer
yield |- |CORRECT |ANSWER✔✔-percentage |of |good |dies |from |the |total |number |of |dies |on |the |
wafer
Cost |Per |Die |- |CORRECT |ANSWER✔✔-Cost_of_wafer |/ |(Dies_per_wafer |* |Die_yield)
Dies |per |wafer |- |CORRECT |ANSWER✔✔-Wafer |area |/ |Die |area
Die |yield |formula |- |CORRECT |ANSWER✔✔-[ |1 |+ |( |{Defects_per_unit_area |* |Die_Area}/ |α) |] |^ |- |
α
α |with |respect |to |dies |- |CORRECT |ANSWER✔✔-number |of |critical |processing |steps |in |the |
manufacturing |process
CPU |execution |time |(CPU |time) |- |CORRECT |ANSWER✔✔-The |actual |time |the |CPU |spends |
computing |for |a |specific |task
User |CPU |time |- |CORRECT |ANSWER✔✔-the |CPU |time |spent |in |the |program |itself
Answers
What |transforms |high-level |language |code |to |Assembly |language? |- |CORRECT |ANSWER✔✔-
Compiler
What |changes |Assembly |language |code |to |Machine |code? |- |CORRECT |ANSWER✔✔-Assembler
Memory |- |CORRECT |ANSWER✔✔-Where |the |programs |and |data |kept
Processor |- |CORRECT |ANSWER✔✔-Active |part |of |the |computer. |It |adds |numbers, |test |
numbers, |signals |I/O |etc
CPU |- |CORRECT |ANSWER✔✔-Central |Processor |Unit
Dram |- |CORRECT |ANSWER✔✔-Dynamic |Random |Access |Memory. |Dynamic |RAM. |takes |the |
same |amount |of |time |to |access |the |memory |no |matter |what |portion |of |the |memory |is |read.
Datapath |- |CORRECT |ANSWER✔✔-Performs |arithmetic |operations
Control |- |CORRECT |ANSWER✔✔-Tells |the |datapath, |memory, |and |I/O |devices |what |to |do |
according |to |the |wishes |of |the |instructions |of |the |program
cache |- |CORRECT |ANSWER✔✔-a |safe |place |for |hiding |things, |consists |of |a |small, |fast |memory |
that |acts |as |a |buffer |for |the |DRAM |memory
, Implementation |- |CORRECT |ANSWER✔✔-hardware |that |obeys |the |architecture |design |of |
principal |technique
Instruction |Set |Architecture |- |CORRECT |ANSWER✔✔-Includes |anything |programmers |need |to |
know |to |make |a |binary |machine |language |program |work |correctly, |including |instructions, |I/O |
devices |and |etc.
VLSI |- |CORRECT |ANSWER✔✔-very |large-scale |integrated |circuit |integrated |circuit |integrates |
hundreds |to |millions |of |transistors |into |a |single |chip
defect |- |CORRECT |ANSWER✔✔-microscopic |flaw |in |a |wafer
yield |- |CORRECT |ANSWER✔✔-percentage |of |good |dies |from |the |total |number |of |dies |on |the |
wafer
Cost |Per |Die |- |CORRECT |ANSWER✔✔-Cost_of_wafer |/ |(Dies_per_wafer |* |Die_yield)
Dies |per |wafer |- |CORRECT |ANSWER✔✔-Wafer |area |/ |Die |area
Die |yield |formula |- |CORRECT |ANSWER✔✔-[ |1 |+ |( |{Defects_per_unit_area |* |Die_Area}/ |α) |] |^ |- |
α
α |with |respect |to |dies |- |CORRECT |ANSWER✔✔-number |of |critical |processing |steps |in |the |
manufacturing |process
CPU |execution |time |(CPU |time) |- |CORRECT |ANSWER✔✔-The |actual |time |the |CPU |spends |
computing |for |a |specific |task
User |CPU |time |- |CORRECT |ANSWER✔✔-the |CPU |time |spent |in |the |program |itself
