Comprehensive Electronics Assembly Inspection
Review with Detailed Rationales | Grade A+
• Class 1 Product -✓✓General Electronics Product - includes products where the major
requirement is function of the completed assembly.
• Class 2 Product -✓✓Dedicated Service Electronic Product - Continued performance
and extended life required. Uninterrupted service is desired but not required.
• Class 3 Product -✓✓High Performance Electrical Product - Continued high
performance or performance-on-demand is critical. Equipment downtime cannot be
tolerated. Equipment might be used for life-support or other critical systems.
• Who as the ultimate responsibility for identifying the class to which the assembly is
evaluated? -✓✓The Customer.
• Shall -✓✓Invokes a requirement for manufacturers of all classes or product, and
failure to comply with the requirement is a noncompliance to this standard.
• Order of Precedence in event of conflict 1 -✓✓1. Procurement as agreed and
documented between customer and supplier.
• Order of Precedence in event of conflict 2 -✓✓Master drawing or master ass. drawing
reflecting the customer's detailed requirements.
• Order of Precedence in event of conflict 3 -✓✓IPC-1-610 when invoked by the
customer or contract.
• If documents other than IPC-A-610 are cited, the order of precedence shall be defined
in the _ -✓✓Procurement documents
• Target Condition -✓✓A condition that is close to perfect, but is not always achievable
and may not be necessary to ensure the reliability of the assembly.
• Acceptable Condition -✓✓A condition that, while not necessarily perfect, will maintain
integrity and reliability of the assembly
• Defect Condition -✓✓The form, fit or function of the assembly is inadequate for use in
its end use environment.
, • A defect for Class 1... -✓✓automatically implies a defect for Class 2 and 3. A defect
for Class 2 implies a defect for Class 3.
• Disposition -✓✓The determination of how defects should be treated. These include
rework, use as is, scrap, and repair.
• Who dispositions defect conditions? -✓✓The manufacturer, based on design, service
and customer requirements.
• Process Indicator Conditions -✓✓A condition (not a defect) that does not affect the
form, fit or function of a product.
• Process indicators should be... -✓✓monitored as part of the process control system
• Is disposition of individual process indicators required? -✓✓No, and affected products
should be used as-is.
• Conditions Not Specified -✓✓A condition that is neither a defect, nor a process
indicator. A condition not specified may be considered acceptable unless it can be
established that the condition affects user-defined form, fit or function.
• Primary Side -✓✓The side of a packaging or interconnecting structure (PCB) defined
as primary on the master drawing. This is usually the side with the most complex or
greatest number of components.
• The Primary Side is also known as... -✓✓the component side, or the solder
destination side (in through-hole mounting technology).
• Solder source side -✓✓The side of the PCB to which solder is applied. This is usually
the secondary side, but might be the primary side in some cases.
• Solder Destination Side -✓✓The side of the PCB that the solder flows toward in
through-hole technology. The destination is is normally the primary side of the PCB, but
might be the secondary side in some cases.
• Cold Solder Connection -✓✓A solder connection that exhibits poor wetting and that is
characterized by a grayish porous appearance.
• What can cause a cold solder connection? -✓✓Excessive impurities in the solder,
inadequate cleaning prior to the soldering, and/or insufficient application of heat during
the soldering process.
• Any violation of minimal electrical clearance is a... -✓✓defect condition for all classes.