❖ Calculations of parasitic elements in high speed PCB. High speed PCB
ECE 511 – ENGINEERING PRODUCT DESIGN design and points to be considered for designing the high speed PCBs
Jack Onyango, AMEI, GEng, MIEK ❖ Mounting in presence of vibration. SMD assemblies
Course Description ❖ Board layout check list. Tests for multilayer PCB
Product Design and development (Chapter 1 & 2) Hardware design and testing methods (Chapter 5)
❖ An overview of product development & product assessment, Pilot ❖ Logic analyzer, its architecture & operation and Use of logic analyzer
production batch, Concept of availability, Screening test, Environmental
❖ Spectrum analyzer
effects on reliability, Redundancy, Failsafe system, Ergonomic &
aesthetic design considerations, Packaging & storage ❖ Network analyzer,
❖ Estimating power supply requirement (Power supply sizing), Power ❖ Oscilloscope , DSO trigger modes
supply protection devices
❖ Examples using MSO
❖ Noise consideration of a typical system, Noise in electronic circuit,
Measurement of noise ❖ Signal integrity issues
❖ Grounding, Shielding and Guarding ❖ Use & limitations of different types of analysis
❖ Enclosure sizing & supply requirements & materials for enclosure and ❖ Monte Carlo analysis
tests carried out on enclosure Product testing (Chapter 7)
❖ Thermal management and its types ❖ Environmental testing for product. Environmental test chambers &
PCB designing (Chapter 3 & 4) rooms. Tests carried out on the enclosures
❖ Layout, PCB sizes, Layout general rules & parameters. ❖ Electromagnetic compatibility (EMC) with respect to compliance.
Recommendations for decoupling & bypassing. Design rules for digital Electromagnetic compatibility (EMC) testing. Conducted emission test
circuit PCB & analog circuit PCBs (time domain methods). Radiated emission test
❖ Noise generation, Supply & ground conductors ❖ Basics on standard used. Instrument specifications
❖ Multilayer boards Documentation (Chapter 8)
❖ Component assembly & testing of assembled PCB, Bare boardtesting. ❖ PCB documentation- Specifying laminate grade, drilling details, PCB
Component assembly techniques finish- Tin, solder, gold, silver plating, hot air leveling, and bare board
testing. Understanding advantages and limitations of each
❖ Automation & computers in PCB design, Computer aided design ,
Design automation ❖ Product documentation- bill of materials, Production test specification-
a case study for real circuit, Interconnection diagram- A case study.,
❖ Soldering techniques, Solderability testing Front and rear panel diagrams for selected product
❖ Study of packages for discrete devices & ICs, IC reliability issues. ❖ Manuals- Instruction or operating manual, Service and Maintenance
manual, Fault finding tree.
❖ Parasitic elements
,
,
,
ECE 511 – ENGINEERING PRODUCT DESIGN design and points to be considered for designing the high speed PCBs
Jack Onyango, AMEI, GEng, MIEK ❖ Mounting in presence of vibration. SMD assemblies
Course Description ❖ Board layout check list. Tests for multilayer PCB
Product Design and development (Chapter 1 & 2) Hardware design and testing methods (Chapter 5)
❖ An overview of product development & product assessment, Pilot ❖ Logic analyzer, its architecture & operation and Use of logic analyzer
production batch, Concept of availability, Screening test, Environmental
❖ Spectrum analyzer
effects on reliability, Redundancy, Failsafe system, Ergonomic &
aesthetic design considerations, Packaging & storage ❖ Network analyzer,
❖ Estimating power supply requirement (Power supply sizing), Power ❖ Oscilloscope , DSO trigger modes
supply protection devices
❖ Examples using MSO
❖ Noise consideration of a typical system, Noise in electronic circuit,
Measurement of noise ❖ Signal integrity issues
❖ Grounding, Shielding and Guarding ❖ Use & limitations of different types of analysis
❖ Enclosure sizing & supply requirements & materials for enclosure and ❖ Monte Carlo analysis
tests carried out on enclosure Product testing (Chapter 7)
❖ Thermal management and its types ❖ Environmental testing for product. Environmental test chambers &
PCB designing (Chapter 3 & 4) rooms. Tests carried out on the enclosures
❖ Layout, PCB sizes, Layout general rules & parameters. ❖ Electromagnetic compatibility (EMC) with respect to compliance.
Recommendations for decoupling & bypassing. Design rules for digital Electromagnetic compatibility (EMC) testing. Conducted emission test
circuit PCB & analog circuit PCBs (time domain methods). Radiated emission test
❖ Noise generation, Supply & ground conductors ❖ Basics on standard used. Instrument specifications
❖ Multilayer boards Documentation (Chapter 8)
❖ Component assembly & testing of assembled PCB, Bare boardtesting. ❖ PCB documentation- Specifying laminate grade, drilling details, PCB
Component assembly techniques finish- Tin, solder, gold, silver plating, hot air leveling, and bare board
testing. Understanding advantages and limitations of each
❖ Automation & computers in PCB design, Computer aided design ,
Design automation ❖ Product documentation- bill of materials, Production test specification-
a case study for real circuit, Interconnection diagram- A case study.,
❖ Soldering techniques, Solderability testing Front and rear panel diagrams for selected product
❖ Study of packages for discrete devices & ICs, IC reliability issues. ❖ Manuals- Instruction or operating manual, Service and Maintenance
manual, Fault finding tree.
❖ Parasitic elements
,
,
,
