690 Electronics Handbook
TABLE 7.9 Various Screening Tests Used to Detect Defects
Test Process Defect Failure Mode
Electrical: Slice Preparation Improper electrical performance, opens,
DC tests, static/dynamic tests, functional Etching shorts, degraded junction
tests, Schmoo plots Wire Bonding characteristics, intermittents
Improper marking Device operates differently than
expected, or not at all
Thermal cycling: Slice preparation Potential short or open circuits, low
MIL-STD-883 (test) method 1010; Japanese Passivation (Fig. 7.162) breakdown voltage, increased leakage,
Industrial Standards Office (JIS) C 7022 A-4; Etching; Diffusions poor performance due to faulty
International Electrotechnical Commission Metallization components, near shorts, near opens,
(IEC) PUB 68; Test Na, Nb DIE separation high resistance internal connections
DIE bonding
Wire bonds; Final seal
Fatigue cracks
(Temp/humidity cycling MIL-STD-883 method
1004; JIS C 7022 A-5; IEC PUB 68; Test Z/AD)
High temperature storage: Etching Lowered device performance due to
MIL-STD-883, method 1008; Slice preparation degradation of junction (soldering
JIS C 7022, B-3 Diffusions; Metallizations characteristics, shorts, potential
Lead bonds; Final seal shorts, opens, high resistance)
Creep; Corrosion
Electromigration; Surface
charge spreading
High temperature/high humidity bias test and
storage test, JIS C 7022, B-5; IEC PUB 68; Test C
(heat test, MIL-STD-750, method 2031;
JIS C 7022; A-1; IEC PUB 68; Test Tb)
(High temperature operation, MIL-STD-883
method 1005; JIS C 7022 B-1)
(Low temperature storage, JIS C 7022, B-4;
IEC PUB 68; Test A)
Reverse bias voltage: Slice preparation Degradation of junction characteristics,
Final seal performance degradation
Operational life test: Slice preparation Degradation of junction
Passivation; Etching characteristics, short circuits,
Diffusions; Metallization leakage, low insulation resistance,
Die bonding; Final seal performance degradation from
Dendrite growth heating or faulty or unstable
internal components, opens,
near opens, near shorts, high
resistance internal connections
Mechanical: Die separation Performance degradation caused
Variable freq. vibration MIL-STD-883 Die bonding; Wire bonds; by overheating, opens or potential
method 2007; JIS C 7022; A-10; Die cracks; Lead shape; opens, shorts or
IEC PUB 68; Test Fc irregularities package; intermittent shorts
irregularities creep
Solderability: Lead finish/plating Intermittent, open or high resistance
MIL-STD-883; METHOD 2003; solder connections between the
JIS C 7022; A-2; part and the circuit board
Salt fog (atmosphere) Tests resistance to corrosion
MIL-STD-883 method 1009; in a salt atmosphere
JIS C 7022; A-12; IEC PUB 68; Test Ka
Copyright 2005 by Taylor & Francis Group
, Semiconductor Devices and Circuits 691
TABLE 7.9 Various Screening Tests Used to Detect Defects (Continued )
Test Process Defect Failure Mode
Thermal shock: Die separation Performance degradation caused by
MIL-STD-883; method 1011; JIS C 7022; Die bonding overheating, opens or potential
A-3; IEC PUB 68; Test Nc opens, shorts or intermittent shorts
X Ray: Die bonding; Wire bonding Performance degradation caused by
Final seal overheating, intermittents, shorts or opens,
Lead frame shape intermittent short circuits caused by loose
irregularities conductive particles in the package.
Acceleration: Die bonding Performance degradation caused by
Constant acceleration; MIL-STD-883 Final seal overheating, weak wires will be open or
method 2001; JIS C 7022; A-9; intermittent, intermittent shorts caused by
IEC PUB 68; Test Ga loose conductive particles in the package
Hi-voltage test: Passivation Open or short circuits, increased device
Final seal leakage, low insulation breakdown
ESD testing: Design susceptibility Degraded device performance or
MIL-STD-883; method 3015 to ESD device failure.
Electronic Industries Association of
Japan (EIAJ) IC 121:20
Vibration/PIND test: Die bonding Shorts or intermittent shorts caused by loose
Wire bonding conductive particles in the package,
performance degradation caused by
overheating, opens and intermittents
Lead fatigue: Final seal Open circuits, external lead loose
Lead integrity; JIS C 7002; A-11;
IEC PUB 68; Test U
Leak tests: Final seal Performance degradation, shorts or opens
Hermetic seal tests; MIL-STD-883 caused by chemical corrosion or moisture,
method 1014; JIS C 7022; A-6; intermittents
IEC PUB 68; Test Q
[Pressure cooker test (PCT) to
evaluate moisture resistance in a
short period of time; EIAJ IC-121: 18]
Precap visual: Slice preparation Increased leakage, low insulation
Passivation; Masking breakdown, opens, shorts, intermittents,
Etching; Metallizations potential shorts or opens, high
Die separation internal resistances, intermittent
Die bonding; Wire bonding shorts
Visual: Final seal Open circuits; package cracks; package
seal problems
r Digital programmable array logic (PAL): 80% failed truth table, 20% shorted
r Interface IC: 58% output stuck low, 16% input open, 16% output open, 10% supply open
r Linear IC: 50% degraded/improper output, 41% no output, 3% shorted, 2% open, 2% drift
r Linear-op amps: 69% degraded (unstable, clipped output, drifted etc.), 13% intermittent, 10%
shorted, 6% overstressed by transients, 3% no output
r Bipolar memory: 79% slow transfer of data, 21% data bit loss
r MOS memory: 34% data bit loss, 26% short, 23% open, 17% slow transfer of data
r Digital memory: 30% single bit error, 25% column error, 25% row error, 10% row and column
error, 10% complete failure
Copyright 2005 by Taylor & Francis Group
TABLE 7.9 Various Screening Tests Used to Detect Defects
Test Process Defect Failure Mode
Electrical: Slice Preparation Improper electrical performance, opens,
DC tests, static/dynamic tests, functional Etching shorts, degraded junction
tests, Schmoo plots Wire Bonding characteristics, intermittents
Improper marking Device operates differently than
expected, or not at all
Thermal cycling: Slice preparation Potential short or open circuits, low
MIL-STD-883 (test) method 1010; Japanese Passivation (Fig. 7.162) breakdown voltage, increased leakage,
Industrial Standards Office (JIS) C 7022 A-4; Etching; Diffusions poor performance due to faulty
International Electrotechnical Commission Metallization components, near shorts, near opens,
(IEC) PUB 68; Test Na, Nb DIE separation high resistance internal connections
DIE bonding
Wire bonds; Final seal
Fatigue cracks
(Temp/humidity cycling MIL-STD-883 method
1004; JIS C 7022 A-5; IEC PUB 68; Test Z/AD)
High temperature storage: Etching Lowered device performance due to
MIL-STD-883, method 1008; Slice preparation degradation of junction (soldering
JIS C 7022, B-3 Diffusions; Metallizations characteristics, shorts, potential
Lead bonds; Final seal shorts, opens, high resistance)
Creep; Corrosion
Electromigration; Surface
charge spreading
High temperature/high humidity bias test and
storage test, JIS C 7022, B-5; IEC PUB 68; Test C
(heat test, MIL-STD-750, method 2031;
JIS C 7022; A-1; IEC PUB 68; Test Tb)
(High temperature operation, MIL-STD-883
method 1005; JIS C 7022 B-1)
(Low temperature storage, JIS C 7022, B-4;
IEC PUB 68; Test A)
Reverse bias voltage: Slice preparation Degradation of junction characteristics,
Final seal performance degradation
Operational life test: Slice preparation Degradation of junction
Passivation; Etching characteristics, short circuits,
Diffusions; Metallization leakage, low insulation resistance,
Die bonding; Final seal performance degradation from
Dendrite growth heating or faulty or unstable
internal components, opens,
near opens, near shorts, high
resistance internal connections
Mechanical: Die separation Performance degradation caused
Variable freq. vibration MIL-STD-883 Die bonding; Wire bonds; by overheating, opens or potential
method 2007; JIS C 7022; A-10; Die cracks; Lead shape; opens, shorts or
IEC PUB 68; Test Fc irregularities package; intermittent shorts
irregularities creep
Solderability: Lead finish/plating Intermittent, open or high resistance
MIL-STD-883; METHOD 2003; solder connections between the
JIS C 7022; A-2; part and the circuit board
Salt fog (atmosphere) Tests resistance to corrosion
MIL-STD-883 method 1009; in a salt atmosphere
JIS C 7022; A-12; IEC PUB 68; Test Ka
Copyright 2005 by Taylor & Francis Group
, Semiconductor Devices and Circuits 691
TABLE 7.9 Various Screening Tests Used to Detect Defects (Continued )
Test Process Defect Failure Mode
Thermal shock: Die separation Performance degradation caused by
MIL-STD-883; method 1011; JIS C 7022; Die bonding overheating, opens or potential
A-3; IEC PUB 68; Test Nc opens, shorts or intermittent shorts
X Ray: Die bonding; Wire bonding Performance degradation caused by
Final seal overheating, intermittents, shorts or opens,
Lead frame shape intermittent short circuits caused by loose
irregularities conductive particles in the package.
Acceleration: Die bonding Performance degradation caused by
Constant acceleration; MIL-STD-883 Final seal overheating, weak wires will be open or
method 2001; JIS C 7022; A-9; intermittent, intermittent shorts caused by
IEC PUB 68; Test Ga loose conductive particles in the package
Hi-voltage test: Passivation Open or short circuits, increased device
Final seal leakage, low insulation breakdown
ESD testing: Design susceptibility Degraded device performance or
MIL-STD-883; method 3015 to ESD device failure.
Electronic Industries Association of
Japan (EIAJ) IC 121:20
Vibration/PIND test: Die bonding Shorts or intermittent shorts caused by loose
Wire bonding conductive particles in the package,
performance degradation caused by
overheating, opens and intermittents
Lead fatigue: Final seal Open circuits, external lead loose
Lead integrity; JIS C 7002; A-11;
IEC PUB 68; Test U
Leak tests: Final seal Performance degradation, shorts or opens
Hermetic seal tests; MIL-STD-883 caused by chemical corrosion or moisture,
method 1014; JIS C 7022; A-6; intermittents
IEC PUB 68; Test Q
[Pressure cooker test (PCT) to
evaluate moisture resistance in a
short period of time; EIAJ IC-121: 18]
Precap visual: Slice preparation Increased leakage, low insulation
Passivation; Masking breakdown, opens, shorts, intermittents,
Etching; Metallizations potential shorts or opens, high
Die separation internal resistances, intermittent
Die bonding; Wire bonding shorts
Visual: Final seal Open circuits; package cracks; package
seal problems
r Digital programmable array logic (PAL): 80% failed truth table, 20% shorted
r Interface IC: 58% output stuck low, 16% input open, 16% output open, 10% supply open
r Linear IC: 50% degraded/improper output, 41% no output, 3% shorted, 2% open, 2% drift
r Linear-op amps: 69% degraded (unstable, clipped output, drifted etc.), 13% intermittent, 10%
shorted, 6% overstressed by transients, 3% no output
r Bipolar memory: 79% slow transfer of data, 21% data bit loss
r MOS memory: 34% data bit loss, 26% short, 23% open, 17% slow transfer of data
r Digital memory: 30% single bit error, 25% column error, 25% row error, 10% row and column
error, 10% complete failure
Copyright 2005 by Taylor & Francis Group
