Paavai Institutions Common to BME and MDE
UNIT-II
MECHANICAL AND THERMAL SENSORS
AND ACTUATORS
1
,Paavai Institutions Common to BME and MDE
S.No Name of the content
2.1 Mechanics for MEMS design
2.2 Static bending of thin plates
2.3 Mechanical Vibration
2.4 Thermal mechanics
2.5 Fracture and thin film mechanics
2.6 Mechanical Sensors and Actuators
2.7 Beam and cantilever
2.8 Microplates and strain
2.9 Pressure and flow measurement
2.10 Thermal sensor and Actuators
2.11 Actuator based on thermal expansion
2.12 Thermal couples
2.13 Thermal resistor
2.14 Shape Memory Alloys
2.15 Inertia sensor
2.16 Flow sensor
2
, Paavai Institutions Common to BME and MDE
TECHNICAL TERMS
1. Mechanics is the relationship between applied forces and resulting
motions.
2. Cantilever – a beam fixed at one end and free at another end.
3. Stress – intensity of force i.e response to mechanical loading.
4. Toughness – a mechanical measure of the ability of a material to absorb
energy upto fracture.
5. Temperature describes the average kinetic energy of molecules within a
material or systems
6. Heat describes the transfer of thermal energy between molecules within
a system.
7. Thermal conduction: the transfer of heat through a solid media in the
presence of a temperature gradient.
8. Temperature gradient: the rate of change of temperature with the
displacement in a given direction.
9. Temperature coefficient: the relative change of a physical property that
is associated with a given change in temperature.
10. Convection occurs due to temperature gradient, i.e. heat energy is
transferred from hot places to cooler places by convection.
11. Natural Thermal convection: the transfer of heat from a surface into a
stationary body of fluid.
12. Forced Thermal convection: the transfer of heat to a body of moving
fluid. The bulk fluid movement provides enhanced heat transfer
compared with that of natural convection.
13. Radiation represents the loss or gain of heat through electromagnetic
radiation propagating in vacuum of air.
14. Thermal resistance is the ratio of temperature difference and the heat
flow.
15. Electrical resistance is the ratio of voltage and current.
3
UNIT-II
MECHANICAL AND THERMAL SENSORS
AND ACTUATORS
1
,Paavai Institutions Common to BME and MDE
S.No Name of the content
2.1 Mechanics for MEMS design
2.2 Static bending of thin plates
2.3 Mechanical Vibration
2.4 Thermal mechanics
2.5 Fracture and thin film mechanics
2.6 Mechanical Sensors and Actuators
2.7 Beam and cantilever
2.8 Microplates and strain
2.9 Pressure and flow measurement
2.10 Thermal sensor and Actuators
2.11 Actuator based on thermal expansion
2.12 Thermal couples
2.13 Thermal resistor
2.14 Shape Memory Alloys
2.15 Inertia sensor
2.16 Flow sensor
2
, Paavai Institutions Common to BME and MDE
TECHNICAL TERMS
1. Mechanics is the relationship between applied forces and resulting
motions.
2. Cantilever – a beam fixed at one end and free at another end.
3. Stress – intensity of force i.e response to mechanical loading.
4. Toughness – a mechanical measure of the ability of a material to absorb
energy upto fracture.
5. Temperature describes the average kinetic energy of molecules within a
material or systems
6. Heat describes the transfer of thermal energy between molecules within
a system.
7. Thermal conduction: the transfer of heat through a solid media in the
presence of a temperature gradient.
8. Temperature gradient: the rate of change of temperature with the
displacement in a given direction.
9. Temperature coefficient: the relative change of a physical property that
is associated with a given change in temperature.
10. Convection occurs due to temperature gradient, i.e. heat energy is
transferred from hot places to cooler places by convection.
11. Natural Thermal convection: the transfer of heat from a surface into a
stationary body of fluid.
12. Forced Thermal convection: the transfer of heat to a body of moving
fluid. The bulk fluid movement provides enhanced heat transfer
compared with that of natural convection.
13. Radiation represents the loss or gain of heat through electromagnetic
radiation propagating in vacuum of air.
14. Thermal resistance is the ratio of temperature difference and the heat
flow.
15. Electrical resistance is the ratio of voltage and current.
3
