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Summary Capacitive Touch Controller

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Decoupling Capacitors The use of decoupling capacitors on power supply pins, such as VDD and VSS, is required (see Figure 5-1). Consider the following criteria when using decoupling capacitors: 1. Value and type of capacitor: A value of 0.1 µF (100 nF), 10-20V is recommended. The capacitor should be a low Equivalent Series Resistance (low ESR) capacitor and have resonance frequency in the range of 20 MHz and higher. It is further recommended that ceramic capacitors be used. 2. Placement on the Printed Circuit Board: The decoupling capacitors should be placed as close to the pins as possible. It is recommended that the capacitors be placed on the same side of the board as the device. If layout space is constrained, the capacitor can be placed on another layer on the PCB and connected using a via. Please ensure that the trace length from the pin to the capacitor is less than onequarter inch (6 mm) in length. 3. Handling high-frequency noise: If the board is experiencing high-frequency noise, upward of tens of MHz, add a second ceramic-type capacitor in parallel to the above-described decoupling capacitor. The value of the second capacitor can be in the range of 0.01 µF to 0.001 µF. Place this second capacitor next to the primary decoupling capacitor. In high-speed circuit designs, consider implementing a decade pair of capacitances as close to the power and ground pins as possible (for example, 0.1 µF in parallel with 0.001 µF). 4. Maximizing performance: On the board layout from the power supply circuit, run the power and return traces to the decoupling capacitors first, and then to the device pins. This ensures that the decoupling capacitors are first in the power chain. It is equally important to keep the MTCH6301 Microchip Technology Inc. DSB-page 7 trace length between the capacitor and the power pins to a minimum, thereby reducing PCB track inductance. 5.3 Bulk Capacitors The use of a bulk capacitor is recommended to improve power supply stability. Typical values range from 4.7 µF to 47 µF. This capacitor should be located as close to the device as possible. 5.4 Capacitor on Internal Voltage Regulator (VCAP) A low ESR (1 ohm) capacitor is required on the VCAP pin, which is used to stabilize the internal voltage regulator output. The VCAP pin must not be connected to VDD and must have a CEFC capacitor with at least a 6V rating, connected to ground. The type can be ceramic or tantalum. 5.5 Touch Sensor Design Considerations 5.5.1 SENSOR PATTERNS AND PCB LAYOUT With regard to touch sensor patterns, please refer to the mTouch Design Center ( information on designing and laying out a touch sensor pattern, as well as using the correct techniques for PCB trace routing. 5.5.2 PROTOTYPING DESIGNS Due to their complexity, touch sensor designs typically require a thorough debugging phase to ensure a reliable product. If possible, it is suggested that flexible prototyping hardware be created with this in mind. A common example is providing external access to the communication lines for quick test and tuning while in-circuit. Microchip’s Projected Capacitive Configuration Utility (PCU) and a configured PICkit Serial Analyzer can assist with early prototype development. See the online Microchip MTCH6301 device page for these and other support materials. 5.5.3 SENSOR OVERLAY MATERIAL To prevent saturation of sensor levels, a minimum 0.5 mm plastic or glass overlay is required for proper operation of the device, even during a prototyping phase, even if this value is different than the final design. Note: At no time should the device be expected to respond correctly to a user touching a bare PCB sensor. 5.5.4 OPERATION WITH AN LCD MTCH6301 has integrated algorithms to detect and minimize the effects of noise, but proper care should always be taken in selecting an LCD and support components with a focus on reducing noise as much as possible. Since the interaction between the touch sensor and display is highly dependent upon the physical arrangement of the components, proper testing should always be executed with a fully integrated device. Please reference your projected capacitive touch screen manufacturer’s integration guide for additional design considerations. 5.6 Sensor Layout Configuration To properly configure a sensor from a physical layout standpoint, the following registers must be correctly set: • RX Pin Map/TX Pin Map • RX Scaling Coefficient/TX Scaling Coefficient • Flip State 5.6.1 RX/TX PIN MAP By default, the RX and TX pins are set as shown in the Typical Application Circuit (see Section 5.1 “Typical Application Circuit”) . It is recommended to keep this layout if possible. If a different layout or a different amount of sensor channels is required, the RX and TX pins are configured via the Pin Map register arrays. To access these arrays, please reference Section 6.0 “Communication Protocol” and Section 7.0 “Memory Map”. The RX and TX lines are configurable for the purpose of making trace routing and board layout more convenient. Please note that while RX pins can be used as TX pins instead, a single pin cannot be used as both an RX and a TX channel concurrently. The pin maps are comprised of Pin Map ID numbers, which are shown in Table 5-1. 5.6.2 RX/ TX SCALING COEFFICIENT

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MTCH6301
Projected Capacitive Touch Controller
Description: Touch Performance:
MTCH6301 is a turnkey projected capacitive controller • > 100 Reports per Second Single Touch

that allows easy integration of multi-touch and gestures • > 60 Reports per Second Dual Touch
to create a rich user interface in your design. Through • Up to 12-Bit Resolution Coordinate Reporting
a sophisticated combination of Self and Mutual Touch Features:
Capacitive scanning for both XY screens and touch
pads, the MTCH6301 allows designers to quickly and • Multi-touch (up to ten touches)
easily integrate projected capacitive touch into their • Gesture Detection and Reporting
application.
• Single and Dual Touch Drawing
• Self and Mutual Signal Acquisition • Built-in Noise
Applications: Detection and Filtering
• Human-Machine Interfaces with Configurable
Button, Keypad or Scrolling Functions Power Management:
• Single-Finger Gesture-Based Interfaces to Swipe,
• Configurable Sleep mode
Scroll or Doubletap Controls
• Integrated Power-on Reset and Brown-out Reset
• Home Automation Control Panels
• 200 µA Sleep Current (typical )
• Security Control Keypads
• Automotive Center Stack Controls
• Gaming Devices • Remote Control Touch Pads Communication Interface:
• I2C™ (up to 400 kbps)
Touch Sensor Support:
• Up to 13RX x 18TX Channels Operating Conditions:
• Individual Channel Tuning for Optimal Sensitivity • 2.4 V to 3.6V, -40ºC to +105ºC
• Works with Printed Circuit Board (PCB) Sensors,
Film, Glass and Flexible Printed Circuit (FPC) Package Types:
Sensors • Cover
Layer Support: - Plastic: • 44- Lead TQFP
up to 3 mm • 44- Lead QFN
- Glass: up to 5 mm

Table of Contents
1.0 System Block Diagram................................................................................................................................................................. 3
2.0 Configuration and Setup............................................................................................................................................................... 3
3.0 Pin Diagram.................................................................................................................................................................................. 4
4.0 Pinout I/O Descriptions................................................................................................................................................................. 5
5.0 Layout........................................................................................................................................................................................... 6
6.0 Communication Protocol ............................................................................................................................................................ 12
7.0 Memory Map .............................................................................................................................................................................. 21
8.0 Special Features ........................................................................................................................................................................ 23
9.0 Electrical Characteristics............................................................................................................................................................ 26
10.0 Ordering Information .................................................................................................................................................................. 30
11.0 Packaging Information................................................................................................................................................................ 31
The Microchip Web Site........................................................................................................................................................................ 38
Customer Change Notification Service................................................................................................................................................. 38
Customer Support................................................................................................................................................................................ 38
Worldwide Sales and Service............................................................................................................................................................... 40




2012-2014 Microchip Technology Inc. DS40001663B-page 1

,MTCH6301
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at . We welcome your feedback.

Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any
page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document
DS30000000).

Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.

Customer Notification System
Register on our web site at www.microchip.com to receive the most current information on all of our products.




DS40001663B-page 2 2012-2014 Microchip Technology Inc.

, MTCH6301




1.0 SYSTEM BLOCK DIAGRAM

2.0 CONFIGURATION AND SETUP
The MTCH6301 is preconfigured for a
12 Receiver (RX)/9 Transmitter (TX) touch sensor, mapped as
shown in Section 5.1 “Typical
Application Circuit”. While the device will work out-
of-the-box using this specific sensor configuration,
most applications will require additional configuration
and sensor tuning to determine the correct set of
parameters to be used in the final application.
Microchip provides a PC-based configuration tool for
this purpose, available in the mTouch™ Sensing
Solution Design Center (www.microchip.com/mtouch).
Use of this tool requires a PICkit™ Serial Analyzer (
updated with MTCH6301 support), as well as access
to the I2C communications bus of the MTCH6301
device.
Once the development process is complete, this
modified parameter set must either be written
permanently to the controller via NVRAM ( see Section
8.3 “Nonvolatile RAM (NVRAM)”), or alternatively, it


2012-2014 Microchip Technology Inc. DS40001663B-page 3

, MTCH6301
can be sent every time the system is powered on. Both
the PICkit Serial Analyzer and the master I2C controller
can be used for this purpose.
3.0 PIN DIAGRAM

FIGURE 3-1: 44-PIN TQFP, QFN(1,2)




SDA 1 33 TX0
TX17 2 32 TX1
TX16 3 31 TX2
TX15 4 30 TX3
TX14 5 29 VSS
VSS 6 MTCH6301
MTCH6301 28 VDD
VCAP 7 27 RX0
INT 8 26 RX1
N/C 9 25 RX2
RX12 10 24 RX3
RX11 11 23 RX4




Note 1: All RX/TX are remappable. Refer to Section 5.6 “Sensor Layout Configuration” for further
information.
2: The metal plate at the bottom of the device is not connected to any pins and it is recommended to
be connected to VSS externally.

4.0 PINOUT I/O DESCRIPTIONS TABLE 4-
1: PINOUT I/O DESCRIPTIONS
Pin Name Pin Number Pin Type Description
RESET 18 I/P Reset Device (active-low)
SCL 44 I Synchronous Serial Clock Input/Output for I2C™
SDA 1 I/O Synchronous Serial Data Input/Output for I2C™
INT 8 O Interrupt (from MTCH6301 to master) for I2C™



DS40001663B-page 4 2012-2014 Microchip Technology Inc.

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