IPC A 610 EXAM LATEST ACTUAL EXAM 100 QUESTIONS
AND CORRECT DETAILED ANSWERS WITH RATIONALES|
AGRADE
Staking Adhesive - Component Bonding
Acceptable - Class 1
Process Indicator - Class 2 - ANSWER: Adhesive material extending from under the
component is visible in the termination area, but end joint width meets minimum
requirements
Staking Adhesive - Component Bonding
Defect - Class 3 - ANSWER: Adhesive materials extending from under the component
are visible in the termination area
Staking Adhesive - Mechanical Strength
Acceptable - Class 1,2,3 - ANSWER: - On round components adhesive adheres to a
minimum 25% of the component height
- On round components a minimum of three beads of staking material placed
approximately evenly around the periphery of the component
- Slight flow under the component body does not damage the components or affect
form, fit and function
Staking Adhesive - Mechanical Strength
Not Established - Class 1
Defect - Class 2,3 - ANSWER: On round components there are less than three beads
of staking material
Staking Adhesive - Mechanical Strength
Defect - Class 1,2,3 - ANSWER: Adhesive is not completely cured and homogemous
QUESTION**: SMT Leads - Plastic Components - ANSWER: Unless otherwise
specified, solder shall not touch a package body or seal. Expectations are when a
copper lead or termination configuration causes the solder fillet to contact a plastic
component body, such as:
- Plastic SOIC family (small outline packages such as SOT, SOD)
SMT Leads - Damage
Defect - Class 1,2,3 - ANSWER: Lead is damaged or deformed more than 10% of the
diameter, width or thickness of the lead
SMT Leads - Flattening
Acceptable - Class 1,2
Defect - Class 3 - ANSWER: The thickness of the flattened lead is less than 40% of the
original diameter
, SMT Connections - ANSWER: - Components with surface and/or termination ends or
sides that are not wettable by design are exempt from solder wetting requirements
in those areas. Solder fillet wetting to the sides or ends of the leads is not required
unless specifically stated.
- Solder fillet may extend through the top bend. Solder should not extend under the
body or surface mount components whose leads are made of Alloy 42 or similar
metals.
SMT Connections
Acceptable - Class 1,2,3 - ANSWER: Component titled/raised does not affect form, fit
or function
Chip Components - Bottom Only Terminations - Side Overhang (A)
Acceptable - Class 1,2 - ANSWER: Side overhang (A) is less than or equal to 50%
width of component termination area (W) or 50% width of land (P), whichever is less
Chip Components - Bottom Only Terminations - Side Overhang (A)
Acceptable - Class 3 - ANSWER: Side overhang (A) is less than or equal to 25% width
of component termination area (W) or 25% width of land (P), whichever is less
Chip Components - Bottom Only Terminations - End Joint Width (C)
Acceptable - Class 1,2 - ANSWER: Minimum end joint width (C) is 50% width of
component termination (W) or 50% width of land (P), whichever is less
Chip Components - Bottom Only Terminations - End Joint Width (C)
Acceptable Class 3 - ANSWER: Minimum end joint width (C) is 75% width of
component termination (W) or 75% width of land (P), whichever is less
Chip Components - Bottom Only Terminations - End Overlap (J)
Acceptable - Class 2 - ANSWER: End overlap (J) between the component termination
and the land is minimum 50% the length of component termination (R)
Chip Components - Bottom Only Terminations - End Overlap
Acceptable - Class 3 - ANSWER: End overlap (J) between the component termination
and the land is minimum 75% the length of component termination (R)
Rectangular or Square End Clip Components - 1,2,3 or 5 Termination(s) - Side
Overhang (A)
Acceptable - Class 1,2 - ANSWER: Side overhang (A) is less than or equal to 50%
width of component termination area (W) or 50% width of land (P), whichever is less
Rectangular or Square End Clip Components - 1,2,3 or 5 Termination(s) - Side
Overhang (A)
Acceptable - Class 3 - ANSWER: Side overhang (A) is less than or equal to 25% width
of component termination area (W) or 25% width of land (P), whichever is less
AND CORRECT DETAILED ANSWERS WITH RATIONALES|
AGRADE
Staking Adhesive - Component Bonding
Acceptable - Class 1
Process Indicator - Class 2 - ANSWER: Adhesive material extending from under the
component is visible in the termination area, but end joint width meets minimum
requirements
Staking Adhesive - Component Bonding
Defect - Class 3 - ANSWER: Adhesive materials extending from under the component
are visible in the termination area
Staking Adhesive - Mechanical Strength
Acceptable - Class 1,2,3 - ANSWER: - On round components adhesive adheres to a
minimum 25% of the component height
- On round components a minimum of three beads of staking material placed
approximately evenly around the periphery of the component
- Slight flow under the component body does not damage the components or affect
form, fit and function
Staking Adhesive - Mechanical Strength
Not Established - Class 1
Defect - Class 2,3 - ANSWER: On round components there are less than three beads
of staking material
Staking Adhesive - Mechanical Strength
Defect - Class 1,2,3 - ANSWER: Adhesive is not completely cured and homogemous
QUESTION**: SMT Leads - Plastic Components - ANSWER: Unless otherwise
specified, solder shall not touch a package body or seal. Expectations are when a
copper lead or termination configuration causes the solder fillet to contact a plastic
component body, such as:
- Plastic SOIC family (small outline packages such as SOT, SOD)
SMT Leads - Damage
Defect - Class 1,2,3 - ANSWER: Lead is damaged or deformed more than 10% of the
diameter, width or thickness of the lead
SMT Leads - Flattening
Acceptable - Class 1,2
Defect - Class 3 - ANSWER: The thickness of the flattened lead is less than 40% of the
original diameter
, SMT Connections - ANSWER: - Components with surface and/or termination ends or
sides that are not wettable by design are exempt from solder wetting requirements
in those areas. Solder fillet wetting to the sides or ends of the leads is not required
unless specifically stated.
- Solder fillet may extend through the top bend. Solder should not extend under the
body or surface mount components whose leads are made of Alloy 42 or similar
metals.
SMT Connections
Acceptable - Class 1,2,3 - ANSWER: Component titled/raised does not affect form, fit
or function
Chip Components - Bottom Only Terminations - Side Overhang (A)
Acceptable - Class 1,2 - ANSWER: Side overhang (A) is less than or equal to 50%
width of component termination area (W) or 50% width of land (P), whichever is less
Chip Components - Bottom Only Terminations - Side Overhang (A)
Acceptable - Class 3 - ANSWER: Side overhang (A) is less than or equal to 25% width
of component termination area (W) or 25% width of land (P), whichever is less
Chip Components - Bottom Only Terminations - End Joint Width (C)
Acceptable - Class 1,2 - ANSWER: Minimum end joint width (C) is 50% width of
component termination (W) or 50% width of land (P), whichever is less
Chip Components - Bottom Only Terminations - End Joint Width (C)
Acceptable Class 3 - ANSWER: Minimum end joint width (C) is 75% width of
component termination (W) or 75% width of land (P), whichever is less
Chip Components - Bottom Only Terminations - End Overlap (J)
Acceptable - Class 2 - ANSWER: End overlap (J) between the component termination
and the land is minimum 50% the length of component termination (R)
Chip Components - Bottom Only Terminations - End Overlap
Acceptable - Class 3 - ANSWER: End overlap (J) between the component termination
and the land is minimum 75% the length of component termination (R)
Rectangular or Square End Clip Components - 1,2,3 or 5 Termination(s) - Side
Overhang (A)
Acceptable - Class 1,2 - ANSWER: Side overhang (A) is less than or equal to 50%
width of component termination area (W) or 50% width of land (P), whichever is less
Rectangular or Square End Clip Components - 1,2,3 or 5 Termination(s) - Side
Overhang (A)
Acceptable - Class 3 - ANSWER: Side overhang (A) is less than or equal to 25% width
of component termination area (W) or 25% width of land (P), whichever is less
