Intro to ICs
All ICs are normally classified order one of two main headings: - correct answerLinear
or digital
Can(inter) package - correct answerIs normally made of glass or metal with pins
connected in a fashion similar to a transistor. A tab is provided to identify pin 1 or an
important pin. Cans are not used for packaging large integrated circuits.
Computers contain a large IC chip (). Size is approximately one inch, and about a
quarter of an inch. It's capable of performing thousands of tasks - correct
answerMicroprocessors
Construction of monolithic construction: - correct answerA wafer of silicon is cut from a
larger piece. Number of ICs that can be created from a wafer depends on wafer's size,
as well as size of ICs being cut. #s range from 25 to 100.
The different layers of doped material are created by using different techniques,
including oxidation, photochemical, chemical, evaporation, and depositing.
On the top of the wafer, wire is deposited to connect all the different components is the
integrated circuit. Wire is manually gold or aluminum. Wafers are cut apart using a
technique similar to cutting glass.
Data book - correct answerGives you most information. Examine the IC and look for the
classification number and manufacture. Use to reference IC. Use the numerical index to
see if the IC is in the book.
The numerical index lists the ICs contained in the book or a series of books, and what
page or book contains the information.
Can't find it? Try another data book, turn to page indicated in numerical index. Top of
page are the ICs. One item is numbered.
Description tells about the IC's operation, variations and different versions, and other
data helps about IC.
Under packages, the different packages and pin assignments for the IC are given. For
digital ICs, data books provide the logic symbol, a function table, and logic diagram (if
applicable).
While logic diagrams and symbols illustrate the constants of ICs, schematics are
provided to show all components of the IC, not grouped into devices. The digital AND
gates are shown as their actual components: resistors, diodes, and transistors.
Digital Integrated Circuit - correct answerMicroprocessors
, shift resistors
NAND gates
DIP (Dual Inline Package) - correct answerIs an individual memory chip. Has dual rows
of pins used to attach it to the motherboard
Dot or notch located on IC = pin 1. Pin close to notch or dot is pin 1. Goes
Counterclockwise.
DIPs, SIPs, and ZIPs: - correct answerPlastic or ceramic. Top and bottom half of ICs
are bonded together with an epoxy. Ceramic package can be sealed better then plastic
packages. Good deals help prevent corrosion and undesirable effects.
Flat pack - correct answerStraight pins exiting the IC and the overall thinness of the
package itself. Numbered like DIP pins. Dot/Notch = pin 1. Other pins identified by
counterclockwise from pin 1.
Mounted in a hole on a PC board to allot both sides of IF to effectively dissipate heat, or
used for surface mounting PC boards. Surface mount ICs don't have leads that extend
through PC board.
Flat pack and Quad flat pack (QFP) packages: - correct answerLike DIPs, SIPs, and
ZIPs, they're made from ceramic or plastic. ONLY major difference between both
groups is the pin arrangement.
Four main categories of IC construction: - correct answer1. Monolithic
2. Thin Film
3. Thick film
4. Hybrid
hybrid integrated circuit - correct answerMixture of both monolithic and thin film devices
all deposited on a single ceramic platform. Even thick film devices can be added for
certain applications.
IC integration - correct answerClassified by the number of components in the IC.
Microprocessor is ULSI (Ultra Large Scale Integration) and the operational amplifier is
SSI (Small Scale Integration).
Integrated Circuit (IC) - correct answerAn electronic circuit having many components,
such as transistors, diodes, resistors, and capacitors, in a single package.
Used in about every electronic application today. Ex: pocket calculator.
Made possible after the discovery of transistors. First developed in 1959 by Texas
Instruments and have revolutionized electronics. Made possible by the invention of
semiconductor devices.
All ICs are normally classified order one of two main headings: - correct answerLinear
or digital
Can(inter) package - correct answerIs normally made of glass or metal with pins
connected in a fashion similar to a transistor. A tab is provided to identify pin 1 or an
important pin. Cans are not used for packaging large integrated circuits.
Computers contain a large IC chip (). Size is approximately one inch, and about a
quarter of an inch. It's capable of performing thousands of tasks - correct
answerMicroprocessors
Construction of monolithic construction: - correct answerA wafer of silicon is cut from a
larger piece. Number of ICs that can be created from a wafer depends on wafer's size,
as well as size of ICs being cut. #s range from 25 to 100.
The different layers of doped material are created by using different techniques,
including oxidation, photochemical, chemical, evaporation, and depositing.
On the top of the wafer, wire is deposited to connect all the different components is the
integrated circuit. Wire is manually gold or aluminum. Wafers are cut apart using a
technique similar to cutting glass.
Data book - correct answerGives you most information. Examine the IC and look for the
classification number and manufacture. Use to reference IC. Use the numerical index to
see if the IC is in the book.
The numerical index lists the ICs contained in the book or a series of books, and what
page or book contains the information.
Can't find it? Try another data book, turn to page indicated in numerical index. Top of
page are the ICs. One item is numbered.
Description tells about the IC's operation, variations and different versions, and other
data helps about IC.
Under packages, the different packages and pin assignments for the IC are given. For
digital ICs, data books provide the logic symbol, a function table, and logic diagram (if
applicable).
While logic diagrams and symbols illustrate the constants of ICs, schematics are
provided to show all components of the IC, not grouped into devices. The digital AND
gates are shown as their actual components: resistors, diodes, and transistors.
Digital Integrated Circuit - correct answerMicroprocessors
, shift resistors
NAND gates
DIP (Dual Inline Package) - correct answerIs an individual memory chip. Has dual rows
of pins used to attach it to the motherboard
Dot or notch located on IC = pin 1. Pin close to notch or dot is pin 1. Goes
Counterclockwise.
DIPs, SIPs, and ZIPs: - correct answerPlastic or ceramic. Top and bottom half of ICs
are bonded together with an epoxy. Ceramic package can be sealed better then plastic
packages. Good deals help prevent corrosion and undesirable effects.
Flat pack - correct answerStraight pins exiting the IC and the overall thinness of the
package itself. Numbered like DIP pins. Dot/Notch = pin 1. Other pins identified by
counterclockwise from pin 1.
Mounted in a hole on a PC board to allot both sides of IF to effectively dissipate heat, or
used for surface mounting PC boards. Surface mount ICs don't have leads that extend
through PC board.
Flat pack and Quad flat pack (QFP) packages: - correct answerLike DIPs, SIPs, and
ZIPs, they're made from ceramic or plastic. ONLY major difference between both
groups is the pin arrangement.
Four main categories of IC construction: - correct answer1. Monolithic
2. Thin Film
3. Thick film
4. Hybrid
hybrid integrated circuit - correct answerMixture of both monolithic and thin film devices
all deposited on a single ceramic platform. Even thick film devices can be added for
certain applications.
IC integration - correct answerClassified by the number of components in the IC.
Microprocessor is ULSI (Ultra Large Scale Integration) and the operational amplifier is
SSI (Small Scale Integration).
Integrated Circuit (IC) - correct answerAn electronic circuit having many components,
such as transistors, diodes, resistors, and capacitors, in a single package.
Used in about every electronic application today. Ex: pocket calculator.
Made possible after the discovery of transistors. First developed in 1959 by Texas
Instruments and have revolutionized electronics. Made possible by the invention of
semiconductor devices.
