ATMAE STUDY GUIDE EXAM 2025
QUESTIONS AND ANSWERS
Many similar and dissimilar materials can be joined - ANS An advantage of both brazing and
soldering is:
Melting temperature of the filler metals - ANS The essential difference between brazing and
soldering is the:
0.001 - 0.006 of an inch / 0.025 - 0.15 of a millimeter - ANS Joint clearances for both brazing
and soldering commonly range from:
Wetting - ANS Another term for capillary action is:
Dip brazing - ANS A brazing process that does not use torches, brazing furnaces or electric
coils is:
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, Lack of mechanical strength - ANS A limitation of the soldering process is:
Thermoplastics - ANS Soldering is not used to join:
Exposing only a small area of the board to the solder at any one time - ANS In wave soldering
excess heat and distortion of the PCB's is avoided by:
840 °F (450°C). - ANS Soldering is done with fillers that melt at below _________ .
deformation and diffusion - ANS Solid-state processes use ______________________to join
materials without molten and re-solidified material in the final bond area.
joint design - ANS Weld process applicability is most dependent upon:
becomes part of the weld - ANS A consumable electrode is one which:
2 Copyright ©2025 FYNDLAY ALL RIGHTS RESERVED.
QUESTIONS AND ANSWERS
Many similar and dissimilar materials can be joined - ANS An advantage of both brazing and
soldering is:
Melting temperature of the filler metals - ANS The essential difference between brazing and
soldering is the:
0.001 - 0.006 of an inch / 0.025 - 0.15 of a millimeter - ANS Joint clearances for both brazing
and soldering commonly range from:
Wetting - ANS Another term for capillary action is:
Dip brazing - ANS A brazing process that does not use torches, brazing furnaces or electric
coils is:
1 Copyright ©2025 FYNDLAY ALL RIGHTS RESERVED.
, Lack of mechanical strength - ANS A limitation of the soldering process is:
Thermoplastics - ANS Soldering is not used to join:
Exposing only a small area of the board to the solder at any one time - ANS In wave soldering
excess heat and distortion of the PCB's is avoided by:
840 °F (450°C). - ANS Soldering is done with fillers that melt at below _________ .
deformation and diffusion - ANS Solid-state processes use ______________________to join
materials without molten and re-solidified material in the final bond area.
joint design - ANS Weld process applicability is most dependent upon:
becomes part of the weld - ANS A consumable electrode is one which:
2 Copyright ©2025 FYNDLAY ALL RIGHTS RESERVED.
