IPC J-STD-001J (Section 4) Exam Questions With
Correct Answers
At |the |start |of |soldering |operations, |component |leads |and |wire |conductors |to |be |soldered |
shall |x1x2x3 |meet |the |solderability |requirements |of |[what]. |Sect |4.1
D1D2D3 |J-STD-002
At |the |start |of |soldering |operations, |printed |circuit |boards |shall |x1x2x3 |meet |the |requirements
|of |[what]. |Sect |4.1
D1D2D3 |J-STD-003
Gold |removal |is |performed |to |reduce |the |risk |of |what? |Sect |4.3.1
Risk |of |failure |associated |with |embrittled |solder.
Gold |embrittlement |shall |x1x2x3 |be |considered |a |defect. |Sect |4.3.1
N1D2D3
Gold |shall |x1x2x3 |be |removed |from |all |solder |cup |terminals |regardless |of |gold |thickness. |Sect |
4.3.1
N1D2D3
What |processes |may |be |used |for |gold |removal |prior |to |installing |a |component |in |an |assembly?
|Sect |4.3.1
Double |tinting |process |or |dynamic |solder |wave.
Gold |removal |is |not |required |when: |Sect |4.3.3
There |is |documented |objective |evidence |available |for |review |or |electroless |nickel/immersion |
gold |ENIG |finish.
Thermally |sensitive |components |shall |x1x2x3 |have |protective |measures |taken |to |prevent |
overheating. |Sect |4.4
D1D2D3
If |a |solder |iron |tip |makes |direct |contact |with |the |end |termination |of |a |sensitive |component |
(i.e. |ceramic |cap), |the |component |shall |x1x2x3 |be |[what]? |Sect |4.4.2
, D1D2D3 |Replaced
When |sleeving |is |required |as |protection |for |glass |components |that |will |be |encapsulated |or |
staked, |the |sleeving |shall |x1x2x3 |be |placed... |Sect |4.7
... |D1D2D3 |on |the |component |prior |to |installation.
Uninsulated |parts |installed |over |exposed |circuitry |shall |x1x2x3 |have |their |leads |formed |to |
provide |a |minimum |of |what |distance |between |the |bottom |of |the |component |body |and |
exposed |circuitry? |Sect |4.7
N1N2D3 |0.25mm |[0.010in]
Unless |otherwise |defined, |the |requirements |for |part |installation |apply |to |both |what |and |
what? |Sect |4.7.1
Wires |and |component |leads
Leads |shall |not |x1x2x3 |have |nicks |or |deformation |exceeding |what |percentage |of |the |diameter?
|Sect |4.7.2
D1D2D3 |10%
Parts |shall |x1x2x3 |be |installed |such |that |they |do |not |obstruct |solder |flow |onto |the |solder |
destination |side. |Sect |4.8
A1P2D3
Metal-cased |components |shall |x1x2x3 |be |isolated |from |adjacent |electrically |conductive |
elements. |Sect |4.9
D1D2D3
Adhesive |materials |shall |not |x1x2x3 |preclude |the |formation |of |an |acceptable |solder |
connection. |Sect |4.10
D1D2D3
Adhesive |materials |extending |from |under |SMT |components |shall |not |x1x2x3 |be |visible |in |the |
solder |connection. |Sect |4.10
A1P2D3
Staking |shall |not |x1x2x3 |contact |an |unsleeved |area |of |a |sleeved |glass |body |component. |Sect |
4.10
D1D2D3
Correct Answers
At |the |start |of |soldering |operations, |component |leads |and |wire |conductors |to |be |soldered |
shall |x1x2x3 |meet |the |solderability |requirements |of |[what]. |Sect |4.1
D1D2D3 |J-STD-002
At |the |start |of |soldering |operations, |printed |circuit |boards |shall |x1x2x3 |meet |the |requirements
|of |[what]. |Sect |4.1
D1D2D3 |J-STD-003
Gold |removal |is |performed |to |reduce |the |risk |of |what? |Sect |4.3.1
Risk |of |failure |associated |with |embrittled |solder.
Gold |embrittlement |shall |x1x2x3 |be |considered |a |defect. |Sect |4.3.1
N1D2D3
Gold |shall |x1x2x3 |be |removed |from |all |solder |cup |terminals |regardless |of |gold |thickness. |Sect |
4.3.1
N1D2D3
What |processes |may |be |used |for |gold |removal |prior |to |installing |a |component |in |an |assembly?
|Sect |4.3.1
Double |tinting |process |or |dynamic |solder |wave.
Gold |removal |is |not |required |when: |Sect |4.3.3
There |is |documented |objective |evidence |available |for |review |or |electroless |nickel/immersion |
gold |ENIG |finish.
Thermally |sensitive |components |shall |x1x2x3 |have |protective |measures |taken |to |prevent |
overheating. |Sect |4.4
D1D2D3
If |a |solder |iron |tip |makes |direct |contact |with |the |end |termination |of |a |sensitive |component |
(i.e. |ceramic |cap), |the |component |shall |x1x2x3 |be |[what]? |Sect |4.4.2
, D1D2D3 |Replaced
When |sleeving |is |required |as |protection |for |glass |components |that |will |be |encapsulated |or |
staked, |the |sleeving |shall |x1x2x3 |be |placed... |Sect |4.7
... |D1D2D3 |on |the |component |prior |to |installation.
Uninsulated |parts |installed |over |exposed |circuitry |shall |x1x2x3 |have |their |leads |formed |to |
provide |a |minimum |of |what |distance |between |the |bottom |of |the |component |body |and |
exposed |circuitry? |Sect |4.7
N1N2D3 |0.25mm |[0.010in]
Unless |otherwise |defined, |the |requirements |for |part |installation |apply |to |both |what |and |
what? |Sect |4.7.1
Wires |and |component |leads
Leads |shall |not |x1x2x3 |have |nicks |or |deformation |exceeding |what |percentage |of |the |diameter?
|Sect |4.7.2
D1D2D3 |10%
Parts |shall |x1x2x3 |be |installed |such |that |they |do |not |obstruct |solder |flow |onto |the |solder |
destination |side. |Sect |4.8
A1P2D3
Metal-cased |components |shall |x1x2x3 |be |isolated |from |adjacent |electrically |conductive |
elements. |Sect |4.9
D1D2D3
Adhesive |materials |shall |not |x1x2x3 |preclude |the |formation |of |an |acceptable |solder |
connection. |Sect |4.10
D1D2D3
Adhesive |materials |extending |from |under |SMT |components |shall |not |x1x2x3 |be |visible |in |the |
solder |connection. |Sect |4.10
A1P2D3
Staking |shall |not |x1x2x3 |contact |an |unsleeved |area |of |a |sleeved |glass |body |component. |Sect |
4.10
D1D2D3
