IPC A 610 EXAM LATEST ACTUAL EXAM 100 QUESTIONS
AND CORRECT DETAILED ANSWERS WITH RATIONALES|
AGRADE
Class 1 Product - ANSWER: General Electronics Product - includes products where
the major requirement is function of the completed assembly.
Class 2 Product - ANSWER: Dedicated Service Electronic Product - Continued
performance and extended life required. Uninterrupted service is desired but not
required.
Class 3 Product - ANSWER: High Performance Electrical Product - Continued high
performance or performance-on-demand is critical. Equipment downtime cannot be
tolerated. Equipment might be used for life-support or other critical systems.
Who as the ultimate responsibility for identifying the class to which the assembly is
evaluated? - ANSWER: The Customer.
Shall - ANSWER: Invokes a requirement for manufacturers of all classes or product,
and failure to comply with the requirement is a noncompliance to this standard.
Order of Precedence in event of conflict 1 - ANSWER: 1. Procurement as agreed and
documented between customer and supplier.
Order of Precedence in event of conflict 2 - ANSWER: Master drawing or master ass.
drawing reflecting the customer's detailed requirements.
Order of Precedence in event of conflict 3 - ANSWER: IPC-1-610 when invoked by the
customer or contract.
If documents other than IPC-A-610 are cited, the order of precedence shall be
defined in the _ - ANSWER: Procurement documents
Target Condition - ANSWER: A condition that is close to perfect, but is not always
achievable and may not be necessary to ensure the reliability of the assembly.
Acceptable Condition - ANSWER: A condition that, while not necessarily perfect, will
maintain integrity and reliability of the assembly
Defect Condition - ANSWER: The form, fit or function of the assembly is inadequate
for use in its end use environment.
A defect for Class 1... - ANSWER: automatically implies a defect for Class 2 and 3. A
defect for Class 2 implies a defect for Class 3.
, Disposition - ANSWER: The determination of how defects should be treated. These
include rework, use as is, scrap, and repair.
Who dispositions defect conditions? - ANSWER: The manufacturer, based on design,
service and customer requirements.
Process Indicator Conditions - ANSWER: A condition (not a defect) that does not
affect the form, fit or function of a product.
Process indicators should be... - ANSWER: monitored as part of the process control
system
Is disposition of individual process indicators required? - ANSWER: No, and affected
products should be used as-is.
Conditions Not Specified - ANSWER: A condition that is neither a defect, nor a
process indicator. A condition not specified may be considered acceptable unless it
can be established that the condition affects user-defined form, fit or function.
Primary Side - ANSWER: The side of a packaging or interconnecting structure (PCB)
defined as primary on the master drawing. This is usually the side with the most
complex or greatest number of components.
The Primary Side is also known as... - ANSWER: the component side, or the solder
destination side (in through-hole mounting technology).
Solder source side - ANSWER: The side of the PCB to which solder is applied. This is
usually the secondary side, but might be the primary side in some cases.
Solder Destination Side - ANSWER: The side of the PCB that the solder flows toward
in through-hole technology. The destination is is normally the primary side of the
PCB, but might be the secondary side in some cases.
Cold Solder Connection - ANSWER: A solder connection that exhibits poor wetting
and that is characterized by a grayish porous appearance.
What can cause a cold solder connection? - ANSWER: Excessive impurities in the
solder, inadequate cleaning prior to the soldering, and/or insufficient application of
heat during the soldering process.
Any violation of minimal electrical clearance is a... - ANSWER: defect condition for all
classes.
Meniscus (component) - ANSWER: Sealant or encapsulant on a lead, protruding from
the seating plane of the component. This includes ceramic, epoxy or other
composites, and flash from molded components.
AND CORRECT DETAILED ANSWERS WITH RATIONALES|
AGRADE
Class 1 Product - ANSWER: General Electronics Product - includes products where
the major requirement is function of the completed assembly.
Class 2 Product - ANSWER: Dedicated Service Electronic Product - Continued
performance and extended life required. Uninterrupted service is desired but not
required.
Class 3 Product - ANSWER: High Performance Electrical Product - Continued high
performance or performance-on-demand is critical. Equipment downtime cannot be
tolerated. Equipment might be used for life-support or other critical systems.
Who as the ultimate responsibility for identifying the class to which the assembly is
evaluated? - ANSWER: The Customer.
Shall - ANSWER: Invokes a requirement for manufacturers of all classes or product,
and failure to comply with the requirement is a noncompliance to this standard.
Order of Precedence in event of conflict 1 - ANSWER: 1. Procurement as agreed and
documented between customer and supplier.
Order of Precedence in event of conflict 2 - ANSWER: Master drawing or master ass.
drawing reflecting the customer's detailed requirements.
Order of Precedence in event of conflict 3 - ANSWER: IPC-1-610 when invoked by the
customer or contract.
If documents other than IPC-A-610 are cited, the order of precedence shall be
defined in the _ - ANSWER: Procurement documents
Target Condition - ANSWER: A condition that is close to perfect, but is not always
achievable and may not be necessary to ensure the reliability of the assembly.
Acceptable Condition - ANSWER: A condition that, while not necessarily perfect, will
maintain integrity and reliability of the assembly
Defect Condition - ANSWER: The form, fit or function of the assembly is inadequate
for use in its end use environment.
A defect for Class 1... - ANSWER: automatically implies a defect for Class 2 and 3. A
defect for Class 2 implies a defect for Class 3.
, Disposition - ANSWER: The determination of how defects should be treated. These
include rework, use as is, scrap, and repair.
Who dispositions defect conditions? - ANSWER: The manufacturer, based on design,
service and customer requirements.
Process Indicator Conditions - ANSWER: A condition (not a defect) that does not
affect the form, fit or function of a product.
Process indicators should be... - ANSWER: monitored as part of the process control
system
Is disposition of individual process indicators required? - ANSWER: No, and affected
products should be used as-is.
Conditions Not Specified - ANSWER: A condition that is neither a defect, nor a
process indicator. A condition not specified may be considered acceptable unless it
can be established that the condition affects user-defined form, fit or function.
Primary Side - ANSWER: The side of a packaging or interconnecting structure (PCB)
defined as primary on the master drawing. This is usually the side with the most
complex or greatest number of components.
The Primary Side is also known as... - ANSWER: the component side, or the solder
destination side (in through-hole mounting technology).
Solder source side - ANSWER: The side of the PCB to which solder is applied. This is
usually the secondary side, but might be the primary side in some cases.
Solder Destination Side - ANSWER: The side of the PCB that the solder flows toward
in through-hole technology. The destination is is normally the primary side of the
PCB, but might be the secondary side in some cases.
Cold Solder Connection - ANSWER: A solder connection that exhibits poor wetting
and that is characterized by a grayish porous appearance.
What can cause a cold solder connection? - ANSWER: Excessive impurities in the
solder, inadequate cleaning prior to the soldering, and/or insufficient application of
heat during the soldering process.
Any violation of minimal electrical clearance is a... - ANSWER: defect condition for all
classes.
Meniscus (component) - ANSWER: Sealant or encapsulant on a lead, protruding from
the seating plane of the component. This includes ceramic, epoxy or other
composites, and flash from molded components.
