VLSI Design

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Introduction: VLSI Design flow, general design methodologies; critical path and worst case timing analysis, overview of design hierarchy, levels of abstraction, integration density and Moore's law, VLSI design styles, packaging, CMOS Logic, Propagation
  • Class notes

    Introduction: VLSI Design flow, general design methodologies; critical path and worst case timing analysis, overview of design hierarchy, levels of abstraction, integration density and Moore's law, VLSI design styles, packaging, CMOS Logic, Propagation

  • Introduction: VLSI Design flow, general design methodologies; critical path and worst case timing analysis, overview of design hierarchy, levels of abstraction, integration density and Moore's law, VLSI design styles, packaging, CMOS Logic, Propagation Delay definitions, sheet resistance.
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Interconnect Parameters: Resistance, Inductance, and Capacitance, skin effect and its influence, lumped RC Model, the distributed RC Model, transient Response, RC delay model, Linear Delay Model, Logical Effort of Paths, Scaling.
  • Class notes

    Interconnect Parameters: Resistance, Inductance, and Capacitance, skin effect and its influence, lumped RC Model, the distributed RC Model, transient Response, RC delay model, Linear Delay Model, Logical Effort of Paths, Scaling.

  • Interconnect Parameters: Resistance, Inductance, and Capacitance, skin effect and its influence, lumped RC Model, the distributed RC Model, transient Response, RC delay model, Linear Delay Model, Logical Effort of Paths, Scaling.
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Dynamic CMOS design: steady-state behavior of dynamic gate circuits, noise considerations in dynamic design, charge sharing, cascading dynamic gates, domino logic, np-CMOS logic, problems in single-phase clocking, two phase non-overlapping clocking scheme
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    Dynamic CMOS design: steady-state behavior of dynamic gate circuits, noise considerations in dynamic design, charge sharing, cascading dynamic gates, domino logic, np-CMOS logic, problems in single-phase clocking, two phase non-overlapping clocking scheme

  • Dynamic CMOS design: steady-state behavior of dynamic gate circuits, noise considerations in dynamic design, charge sharing, cascading dynamic gates, domino logic, np-CMOS logic, problems in single-phase clocking, two phase non-overlapping clocking scheme, Sequential CMOS Logic Circuits, Layout design.
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Semiconductor Memories: Dynamic Random Access Memories (DRAM), Static RAM, non- volatile memories, flash memories, Pipeline Architecture. Low – Power CMOS Logic Circuits: Introduction, Overview of Power Consumption, Low – Power Design through voltage scal
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    Semiconductor Memories: Dynamic Random Access Memories (DRAM), Static RAM, non- volatile memories, flash memories, Pipeline Architecture. Low – Power CMOS Logic Circuits: Introduction, Overview of Power Consumption, Low – Power Design through voltage scal

  • Semiconductor Memories: Dynamic Random Access Memories (DRAM), Static RAM, non- volatile memories, flash memories, Pipeline Architecture. Low – Power CMOS Logic Circuits: Introduction, Overview of Power Consumption, Low – Power Design through voltage scaling,
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Introduction to Testing: Faults in digital circuits. Modeling of faults, Functional Modeling at the Logic Level, Functional Modeling at the Register, Structural Model and Level of Modeling. Design for Testability, Ad Hoc Design for Testability Techniques,
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    Introduction to Testing: Faults in digital circuits. Modeling of faults, Functional Modeling at the Logic Level, Functional Modeling at the Register, Structural Model and Level of Modeling. Design for Testability, Ad Hoc Design for Testability Techniques,

  • Introduction to Testing: Faults in digital circuits. Modeling of faults, Functional Modeling at the Logic Level, Functional Modeling at the Register, Structural Model and Level of Modeling. Design for Testability, Ad Hoc Design for Testability Techniques, Controllability and Observability, Introduction to Built-in-self-test (BIST) Concept.
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